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NLV14512BDG

Onsemi

NLV14512BDG by Onsemi

NLV14512BDG by Onsemi is a CMOS Multiplexer with 8 inputs, 650 ns propagation delay at 5V. AEC-Q100 screened for automotive applications, it operates b/w -55 to 125 °C and supports a load capacitance of 50 pF.

Median Price

$0.352

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 12,868 parts In-Stock

1+ parts

-

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$0.242

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12,868

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$0.242

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Rochester

USA . 6,436 parts In-Stock

1+ parts

-

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$0.352

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$0.292

10k+ parts

$0.261

6,436

-

$0.352

$0.292

$0.261

Verical

USA . 6,436 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.396

10k+ parts

$0.326

6,436

-

-

$0.396

$0.326

Distributors (In-Stock)

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Digiode

USA . 1,543 parts In-Stock

1+ parts

$0.275

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1,543

$0.275

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Vyrian

USA . 7,242 parts In-Stock

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7,242

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Distributors (Availability)

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Corohmni

South Africa . 323 parts In-Stock

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$0.242

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323

$0.242

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Corphita

USA . 771 parts In-Stock

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$0.260

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771

$0.260

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-

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Vigor

Singapore . 437 parts In-Stock

1+ parts

$0.280

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437

$0.280

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Component Stockers USA

USA . 9,124 parts In-Stock

1+ parts

$0.300

100+ parts

$0.280

1k+ parts

$0.250

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-

9,124

$0.300

$0.280

$0.250

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AZTECH Wire

Italy . 93 parts In-Stock

1+ parts

$9.770

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93

$9.770

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Continental Prestige Electronics

USA . 6,436 parts In-Stock

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$0.242

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6,436

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$0.242

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SupplyDigital Components

Austria . 5,446 parts In-Stock

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5,446

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Kulean Microsystems

USA . 4,880 parts In-Stock

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TANS Electronics

Latvia . 3,690 parts In-Stock

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Problanco Electronics

Mexico . 2,380 parts In-Stock

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UHIMA Technologies

Türkiye . 546 parts In-Stock

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546

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Microchip USA

USA . 376 parts In-Stock

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376

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Overview

Experience advanced technology with the NLV14512BDG by Onsemi, a high-quality Multiplexer & Demultiplexer designed to deliver unparalleled performance in a compact package. With a Propagation Delay of just 650ns and AEC-Q100 screening level, this device offers fast and reliable operation, making it ideal for a wide range of applications. From industrial automation to automotive systems, this product provides exceptional value, efficiency, and precision, ensuring seamless integration into your designs. Trust Onsemi for superior quality and innovation, and elevate your projects to new heights with the NLV14512BDG.

Feature Benefit Bullets

Propagation Delay at Nominal Supply - 650 ns

Low propagation delay ensures fast data processing, making this product suitable for applications where speed is crucial.

No. of Inputs - 8

Having 8 inputs allows for high connectivity and the ability to handle multiple input signals efficiently.

Package Style (Meter) - SMALL OUTLINE

Small outline package makes the product compact and ideal for space-constrained applications.

Maximum Operating Temperature - 125 °C

The high maximum operating temperature ensures the product can withstand extreme temperature environments, making it reliable in harsh conditions.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Multiplexer & Demultiplexer NLV14512BDG attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-XDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14512BDG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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