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NLV14512BDR2G

Onsemi

NLV14512BDR2G by Onsemi

NLV14512BDR2G by Onsemi is a CMOS multiplexer with 8 inputs, 650 ns propagation delay at 5V. AEC-Q100 screened for automotive applications, it operates b/w -55 to 125 °C. With small outline packaging and true output polarity, it suits military-grade electronics.

Median Price

$0.287

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,465 parts In-Stock

1+ parts

$0.550

100+ parts

$0.300

1k+ parts

$0.259

10k+ parts

$0.234

2,465

$0.550

$0.300

$0.259

$0.234

Mouser Electronics

USA . 2,205 parts In-Stock

1+ parts

$0.550

100+ parts

$0.301

1k+ parts

$0.259

10k+ parts

$0.244

2,205

$0.550

$0.301

$0.259

$0.244

Rochester

USA . 4,100 parts In-Stock

1+ parts

-

100+ parts

$0.287

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$0.238

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$0.212

4,100

-

$0.287

$0.238

$0.212

Chip1Stop

Japan . 2,500 parts In-Stock

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-

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$0.275

2,500

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$0.275

Verical

USA . 1,651 parts In-Stock

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$0.266

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$0.266

Distributors (In-Stock)

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Vyrian

USA . 1,656 parts In-Stock

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$0.182

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$0.182

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Digiode

USA . 1,758 parts In-Stock

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$0.223

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1,758

$0.223

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Flip Electronics

USA . 5,000 parts In-Stock

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Chip Stock

USA . 2,500 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 163 parts In-Stock

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$0.182

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163

$0.182

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Corphita

USA . 286 parts In-Stock

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$0.212

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286

$0.212

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Vigor

Singapore . 176 parts In-Stock

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$0.290

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176

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TANS Electronics

Latvia . 8,381 parts In-Stock

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Problanco Electronics

Mexico . 7,363 parts In-Stock

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Continental Prestige Electronics

USA . 2,449 parts In-Stock

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$0.245

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$0.245

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SupplyDigital Components

Austria . 2,237 parts In-Stock

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2,237

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Kulean Microsystems

USA . 846 parts In-Stock

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UHIMA Technologies

Türkiye . 720 parts In-Stock

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Overview

Discover the innovative NLV14512BDR2G by Onsemi, a top-tier Multiplexer & Demultiplexer designed to deliver exceptional performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers a seamless integration with a wide range of applications. With its premium quality and cutting-edge technology, the NLV14512BDR2G ensures efficient operation and precise results. Experience the value and advantages this product brings to your projects, making it a smart choice for all your electronic needs. Elevate your designs with the NLV14512BDR2G and unlock a world of possibilities.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 650 ns

Low propagation delay ensures fast and efficient data transmission.

No. of Inputs: 8

Multiple input options allow for versatile connectivity and switching capabilities.

Nominal Supply Voltage / Vsup: 5V

Suitable voltage for common electronic devices, ensuring compatibility.

Package Style (Meter): SMALL OUTLINE

Compact package size saves space and allows for easy integration into circuit designs.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling flexibility in signal routing.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and fast switching speeds, ideal for efficient operation.

Technical Specifications

Multiplexer & Demultiplexer NLV14512BDR2G attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-XDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

650 ns

Propagation Delay (tpd):

650 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NLV14512BDR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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