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NIF9N05CLT1G

Onsemi

NIF9N05CLT1G by Onsemi

NIF9N05CLT1G by Onsemi is a Power FET with 52V DS Breakdown Voltage, 10A IDM, and 0.125 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The package is RECTANGULAR with GULL WING terminals, suitable for ENHANCEMENT MODE operation at up to 150 °C.

Median Price

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Lifecycle Status

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J2 Sourcing AB

Sweden . 10,000 parts In-Stock

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Vyrian

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Digiode

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Elcom Components

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ComSIT Distribution GmbH

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ACDS - Activité Composants Distribution Service

France . 800 parts In-Stock

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Microfarads

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Semtec, LLC

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AZTECH Wire

Italy . 79 parts In-Stock

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Kepictronics

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

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Kulean Microsystems

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Metaverse IC Inc.

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TANS Electronics

Latvia . 4,604 parts In-Stock

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RC Electronics

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Problanco Electronics

Mexico . 3,674 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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Cyclops Electronics Ltd (Excess)

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UHIMA Technologies

Türkiye . 715 parts In-Stock

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Overview

Unleash the power of innovation with the NIF9N05CLT1G by Onsemi. Designed with precision and expertise, this Power Field Effect Transistor (FET) offers unparalleled performance in switching applications. With a built-in diode and resistor, this N-CHANNEL transistor ensures seamless operation and reliability. Ideal for enhancing efficiency and power management, this product is a game-changer in the field of electronics. Trust Onsemi for quality and trust the NIF9N05CLT1G for unmatched value and benefits. Elevate your projects to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, perfect for use in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and lower ON resistance compared to P-channel FETs, making them a popular choice for switching applications.

Minimum DS Breakdown Voltage: 52 V

The high breakdown voltage ensures that the FET can withstand higher voltage levels, providing reliability and protection in applications with higher power requirements.

Maximum Pulsed Drain Current (IDM): 10 A

The high pulsed drain current rating allows for handling sudden spikes in current, making the FET suitable for applications that require high peak current capabilities.

Maximum Operating Temperature: 150 °C

The high operating temperature rating ensures the FET can operate reliably even in high-temperature environments, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NIF9N05CLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NIF9N05CLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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