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NIF9N05ACLT3G

Onsemi

NIF9N05ACLT3G by Onsemi

NIF9N05ACLT3G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 52V DS Breakdown Voltage, 10A Max Pulsed Drain Current, and 0.125 ohm Max Drain-Source Resistance. Ideal for high-power switching circuits in various electronic devices.

Median Price

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Vyrian

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Problanco Electronics

Mexico . 4,256 parts In-Stock

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SupplyDigital Components

Austria . 3,549 parts In-Stock

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Kulean Microsystems

USA . 2,551 parts In-Stock

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TANS Electronics

Latvia . 1,910 parts In-Stock

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Corphita

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Corohmni

South Africa . 439 parts In-Stock

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UHIMA Technologies

Türkiye . 203 parts In-Stock

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Overview

Unlock the power of innovation with the NIF9N05ACLT3G by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor is designed to exceed expectations in switching applications. With a robust design featuring a built-in diode and resistor, this transistor ensures seamless performance and reliability. Experience enhanced efficiency and optimal power management with this N-channel transistor. Elevate your projects to new heights with the unparalleled quality and performance of Onsemi's NIF9N05ACLT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power FET.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow in the desired direction for better performance.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design and saves space by incorporating additional components within the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable and efficient operation.

Surface Mount: YES

Easily mountable on a PCB for convenient integration into electronic devices.

Minimum DS Breakdown Voltage: 52 V

Offers a high breakdown voltage for handling larger voltages without damage.

Package Shape: RECTANGULAR

Provides a compact form factor for space-saving installation in tight spaces.

Terminal Form: GULL WING

Facilitates easy soldering onto PCBs for quick and secure connections.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the power flow, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 10 A

Capable of handling high current surges for demanding applications.

Avalanche Energy Rating (EAS): 110 mJ

Can withstand high energy pulses without damage, ensuring long-term reliability.

Maximum Drain Current (Abs) (ID): 2.6 A

Sufficient current-carrying capacity for various electronic applications.

No. of Terminals: 4

Provides multiple connection points for versatile circuit configurations.

Maximum Power Dissipation (Abs): 1.69 W

Handles power dissipation effectively to prevent overheating and ensure reliability.

Package Style (Meter): SMALL OUTLINE

Compact package design for space-efficient installation in electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced MOSFET technology for efficient power handling and control.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures for reliable operation in harsh environments.

Transistor Element Material: SILICON

High-quality material for the transistor element, ensuring performance and longevity.

Terminal Finish: MATTE TIN

Provides a reliable and corrosion-resistant finish for long-lasting solder connections.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance for efficient power transfer and minimal power loss.

Terminal Position: DUAL

Dual terminal position for versatile mounting options in various circuit layouts.

Case Connection: DRAIN

Ensures proper connection for efficient power flow in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) NIF9N05ACLT3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NIF9N05ACLT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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