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NIF9N05CLT4

Onsemi

NIF9N05CLT4 by Onsemi

NIF9N05CLT4 by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 59V DS Breakdown Voltage, 10A IDM, and 0.2 ohm RDS(ON). This SMALL OUTLINE transistor has a built-in diode and resistor, making it ideal for high-performance electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,986 parts In-Stock

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Vyrian

USA . 821 parts In-Stock

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821

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Kulean Microsystems

USA . 5,060 parts In-Stock

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5,060

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SupplyDigital Components

Austria . 4,757 parts In-Stock

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TANS Electronics

Latvia . 3,391 parts In-Stock

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Corphita

USA . 2,211 parts In-Stock

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Problanco Electronics

Mexico . 1,291 parts In-Stock

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UHIMA Technologies

Türkiye . 484 parts In-Stock

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484

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Corohmni

South Africa . 389 parts In-Stock

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Overview

Unleash the power of innovation with the NIF9N05CLT4 by Onsemi. As a leading manufacturer in the industry, Onsemi's Power Field Effect Transistors (FET) are designed for optimal performance and reliability. With its N-Channel configuration, built-in diode and resistor, and enhanced mode operation, this transistor is perfect for switching applications. The NIF9N05CLT4 offers customers unparalleled value, benefits, and advantages, making it the ideal choice for your electronic projects. Upgrade to Onsemi and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and heat resistance, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify circuit design and reduce external component count, making this FET more efficient and cost-effective.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power consumption.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and enabling automated assembly processes.

Minimum DS Breakdown Voltage: 59 V

With a high breakdown voltage, this FET can handle higher voltages and offers better protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easy to mount, making it compatible with a wide range of PCB layouts.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and reliable electrical contact, ensuring stable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer higher transconductance and faster switching speeds, making them ideal for high-performance applications.

Maximum Pulsed Drain Current (IDM): 10 A

With a high pulsed drain current rating, this FET can handle short-term current spikes without risk of damage or overheating.

No. of Terminals: 3

Having 3 terminals allows for easy interfacing with other components and flexible circuit design options.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability, low gate leakage, and stable performance over temperature variations.

Transistor Element Material: SILICON

Silicon-based transistors offer high power efficiency, low noise levels, and good thermal stability, making them a popular choice for various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and corrosion resistance, ensuring a long-lasting and reliable connection.

Maximum Drain Current (ID): 2.6 A

With a high drain current rating, this FET can handle continuous current flow without overheating or performance degradation.

Maximum Drain-Source On Resistance: 0.2 ohm

The low on-resistance of 0.2 ohms minimizes power loss and heat generation, making this FET efficient for high-current applications.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit design and allows for easy connection to external components or heat sinks.

Technical Specifications

Power Field Effect Transistors (FET) NIF9N05CLT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

59 V

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

10 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NIF9N05CLT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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