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NIF9N05ACLT1G

Onsemi

NIF9N05ACLT1G by Onsemi

NIF9N05ACLT1G by Onsemi is a Power FET with N-CHANNEL polarity, suitable for SWITCHING applications. It features a 52V DS Breakdown Voltage, 10A Max Pulsed Drain Current, and 0.125 ohm Max Drain-Source Resistance. Ideal for use in circuits requiring high power dissipation and efficient switching capabilities.

Median Price

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Lifecycle Status

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In-Stock Inventory

1k+

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Digiode

USA . 1,022 parts In-Stock

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Vyrian

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Kepictronics

USA . 34,226 parts In-Stock

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Kulean Microsystems

USA . 7,828 parts In-Stock

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SupplyDigital Components

Austria . 4,180 parts In-Stock

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TANS Electronics

Latvia . 2,264 parts In-Stock

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Corphita

USA . 1,744 parts In-Stock

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Problanco Electronics

Mexico . 1,218 parts In-Stock

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Corohmni

South Africa . 340 parts In-Stock

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UHIMA Technologies

Türkiye . 187 parts In-Stock

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Overview

Experience superior performance and reliability with the NIF9N05ACLT1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors like this N-CHANNEL device with a built-in diode and resistor for enhanced functionality. Ideal for switching applications, this transistor offers a maximum pulsing drain current of 10A and a minimum breakdown voltage of 52V. With its small outline package shape and matte tin terminal finish, this transistor is designed for optimal efficiency and ease of use. Trust Onsemi to provide cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and faster switching capabilities, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND RESISTOR

Simplifies circuit design and saves space by integrating additional components into the package, reducing the overall cost of the system.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing efficient control and regulation of power flow.

Surface Mount: YES

Allows for easy and convenient installation on printed circuit boards, saving time and effort in the manufacturing process.

Minimum DS Breakdown Voltage: 52 V

Can handle higher voltages, making it suitable for power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

Facilitates efficient board layout and integration into existing systems.

Terminal Form: GULL WING

Enables reliable solder connections and ease of assembly.

Operating Mode: ENHANCEMENT MODE

Provides enhanced control over the transistor's operation, allowing for precise switching performance.

Maximum Pulsed Drain Current (IDM): 10 A

Capable of handling high currents in short pulses, making it suitable for applications requiring momentary power surges.

Avalanche Energy Rating (EAS): 110 mJ

Can withstand energy spikes without damage, ensuring reliable performance in harsh environments.

Maximum Drain Current (Abs) (ID): 2.6 A

Sufficient current handling capabilities for a wide range of applications.

No. of Terminals: 4

Provides multiple connection points for flexibility in circuit design.

Maximum Power Dissipation (Abs): 1.69 W

Efficiently dissipates heat to prevent overheating and ensure long-term reliability.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB and allows for denser layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high performance and reliability in a variety of operating conditions.

Maximum Operating Temperature: 150 °C

Can operate reliably at high temperatures, suitable for demanding industrial environments.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its stability and efficiency in electronic devices.

Terminal Finish: MATTE TIN

Provides a reliable connection and prevents oxidation for long-lasting performance.

Maximum Drain-Source On Resistance: 0.125 ohm

Low ON-resistance minimizes power loss and heat generation, improving efficiency.

Terminal Position: DUAL

Offers flexibility in circuit design and facilitates easy integration into different systems.

Case Connection: DRAIN

Simplifies the connection to the drain terminal, making installation and troubleshooting easier.

Technical Specifications

Power Field Effect Transistors (FET) NIF9N05ACLT1G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

110 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

52 V

Maximum Drain Current (Abs) (ID):

2.6 A

Maximum Drain Current (ID):

2.6 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-261AA

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

10 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NIF9N05ACLT1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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