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NDP6060L

Onsemi

NDP6060L by Onsemi

NDP6060L by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 144A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.025 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 100W and can handle up to 48A drain current.

Median Price

$2.755

Lifecycle Status

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Chip1Stop

Japan . 20 parts In-Stock

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$2.660

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Farnell

UK . 780 parts In-Stock

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$2.850

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$1.510

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$1.330

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Mouser Electronics

USA . 4,611 parts In-Stock

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$4.060

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$1.870

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$1.580

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DigiKey

USA . 851 parts In-Stock

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$4.060

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$1.876

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$1.430

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$1.381

851

$4.060

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Newark

USA . 822 parts In-Stock

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$4.640

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$2.460

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Element14

Singapore . 780 parts In-Stock

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Verical

USA . 3,950 parts In-Stock

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$2.318

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$1.612

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Master Electronics

USA . 3,950 parts In-Stock

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$1.970

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$1.370

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EBV Elektronik

Germany . 700 parts In-Stock

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Rochester

USA . 584 parts In-Stock

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Arrow

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Digiode

USA . 1,192 parts In-Stock

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Vyrian

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Component Electronics Inc.

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$1.920

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$1.440

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$1.250

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$1.920

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TME

Poland . 42 parts In-Stock

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$3.190

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$2.300

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IBS Electronics

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$3.632

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Astute Electronics Inc

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PC Components Company LLC

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Bristol Electronics

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NAC Semi

USA . 550 parts In-Stock

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Prism Electronics

USA . 540 parts In-Stock

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ComSIT Distribution GmbH

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Lantek

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Speed Components Ltd

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ECAB

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Advanced Electronics

New Zealand . 150 parts In-Stock

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$0.652

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$0.588

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Corphita

USA . 2,377 parts In-Stock

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Corohmni

South Africa . 214 parts In-Stock

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Component Stockers USA

USA . 23,194 parts In-Stock

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$1.700

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$1.540

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$1.480

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$1.530

23,194

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$1.530

Continental Prestige Electronics

USA . 758 parts In-Stock

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$2.380

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$1.490

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Perfect Parts

USA . 21,889 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kulean Microsystems

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Microchip USA

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Metaverse IC Inc.

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Infinite Electronics LLP (Excess)

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SupplyDigital Components

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Kepictronics

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UHIMA Technologies

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GreenTree Electronics

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Overview

Elevate your power management solutions with the NDP6060L from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) like no other. This N-CHANNEL transistor with built-in diode is perfect for various switching applications, providing reliable performance and efficiency. With a high DS Breakdown Voltage of 60V and a maximum Drain Current of 48A, this transistor offers exceptional power dissipation and operating temperature range. Upgrade your projects with the NDP6060L and experience the value, benefits, and advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a body material provides durability and protection, making this product suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs offer lower ON-resistance and higher efficiency compared to P-channel FETs, making this product more efficient in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect the circuit from voltage spikes and reverse polarity, enhancing the reliability of the overall system.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast turn-on and turn-off times, ideal for high-frequency switching circuits.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages without breakdown, ensuring reliable operation in power circuits.

Maximum Pulsed Drain Current (IDM): 144 A

The high pulsed drain current rating allows for handling short duration high current spikes, making this FET suitable for power applications that require pulse operation.

Maximum Power Dissipation (Abs): 100 W

With a maximum power dissipation of 100W, this FET can handle higher power levels without overheating, ensuring longevity and reliability in high-power applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows this FET to operate reliably in high-temperature environments, expanding its range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NDP6060L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

200 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

48 A

Maximum Drain Current (ID):

48 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

144 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDP6060L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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