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NDF08N60ZG

Onsemi

NDF08N60ZG by Onsemi

NDF08N60ZG by Onsemi is a Power FET with 600V DS Breakdown Voltage, 30A IDM, and 0.95 ohm RDS(on). It is an N-CHANNEL transistor in PLASTIC/EPOXY package ideal for power applications. Operating in ENHANCEMENT MODE, it has a max power dissipation of 36W at 150°C.

Median Price

$0.686

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 294 parts In-Stock

1+ parts

$1.190

100+ parts

$0.760

1k+ parts

$0.525

10k+ parts

$0.449

294

$1.190

$0.760

$0.525

$0.449

Rochester

USA . 55,666 parts In-Stock

1+ parts

-

100+ parts

$0.674

1k+ parts

$0.559

10k+ parts

$0.498

55,666

-

$0.674

$0.559

$0.498

DigiKey

USA . 55,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.570

10k+ parts

-

55,666

-

-

$0.570

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Verical

USA . 53,550 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.699

10k+ parts

$0.623

53,550

-

-

$0.699

$0.623

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,184 parts In-Stock

1+ parts

$0.524

100+ parts

-

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-

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2,184

$0.524

-

-

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Vyrian

USA . 374 parts In-Stock

1+ parts

$0.552

100+ parts

-

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10k+ parts

-

374

$0.552

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,669 parts In-Stock

1+ parts

$0.497

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$0.497

-

-

-

Corohmni

South Africa . 94 parts In-Stock

1+ parts

$0.552

100+ parts

-

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-

10k+ parts

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94

$0.552

-

-

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Component Stockers USA

USA . 46,616 parts In-Stock

1+ parts

$0.560

100+ parts

$0.530

1k+ parts

$0.480

10k+ parts

$0.480

46,616

$0.560

$0.530

$0.480

$0.480

Microchip USA

USA . 270 parts In-Stock

1+ parts

$3.445

100+ parts

-

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-

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270

$3.445

-

-

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Continental Prestige Electronics

USA . 55,666 parts In-Stock

1+ parts

-

100+ parts

$0.456

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10k+ parts

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55,666

-

$0.456

-

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A-Z Elektronik GmbH

Germany . 7,212 parts In-Stock

1+ parts

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7,212

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TANS Electronics

Latvia . 6,435 parts In-Stock

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6,435

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Problanco Electronics

Mexico . 6,375 parts In-Stock

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6,375

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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SupplyDigital Components

Austria . 4,268 parts In-Stock

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4,268

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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ChipstoGo Electronic ltd

UK . 1,950 parts In-Stock

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1,950

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Perfect Parts

USA . 802 parts In-Stock

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802

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UHIMA Technologies

Türkiye . 250 parts In-Stock

1+ parts

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250

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Kulean Microsystems

USA . 106 parts In-Stock

1+ parts

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106

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Overview

Enhance your power systems with the NDF08N60ZG by Onsemi, a high-quality N-channel Power FET with a built-in diode. Manufactured by Onsemi, a leader in semiconductor technology, this transistor offers reliable performance and efficiency. Ideal for a variety of applications, from industrial to automotive, this transistor provides high voltage breakdown, low on-resistance, and excellent thermal performance. Say goodbye to overheating and hello to seamless power management with the NDF08N60ZG. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

Allows for efficient flow of current in the specified direction.

Minimum DS Breakdown Voltage: 600 V

Ensures high voltage handling capability, suitable for various applications.

Terminal Form: THROUGH-HOLE

Allows for easy and secure mounting on a PCB.

Maximum Pulsed Drain Current (IDM): 30 A

Capable of handling high current pulses without damage.

Maximum Power Dissipation (Abs): 36 W

Can dissipate heat effectively, ensuring reliable performance under load.

Maximum Operating Temperature: 150 °C

Can operate in high temperature environments without issues.

Transistor Element Material: SILICON

Silicon provides good performance and reliability for power FETs.

Technical Specifications

Power Field Effect Transistors (FET) NDF08N60ZG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

235 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

8.4 A

Maximum Drain Current (ID):

8.4 A

Maximum Drain-Source On Resistance:

.95 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON

Trade Compliance

NDF08N60ZG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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