Loading...

NDF06N62ZG

Onsemi

NDF06N62ZG by Onsemi

NDF06N62ZG by Onsemi is a Power FET with 620V DS Breakdown Voltage, 20A IDM, and 1.2 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. The device operates in ENHANCEMENT MODE and has a max temperature of 150 °C suitable for various industrial uses.

Median Price

$0.647

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,350 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

5,350

-

$0.647

$0.537

$0.479

DigiKey

USA . 5,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.550

10k+ parts

-

5,350

-

-

$0.550

-

Verical

USA . 5,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.672

10k+ parts

$0.599

5,350

-

-

$0.672

$0.599

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,472 parts In-Stock

1+ parts

$0.504

100+ parts

-

1k+ parts

-

10k+ parts

-

2,472

$0.504

-

-

-

Vyrian

USA . 821 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

821

$0.531

-

-

-

J2 Sourcing AB

Sweden . 744 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

744

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 405 parts In-Stock

1+ parts

$0.478

100+ parts

-

1k+ parts

-

10k+ parts

-

405

$0.478

-

-

-

Corohmni

South Africa . 379 parts In-Stock

1+ parts

$0.531

100+ parts

-

1k+ parts

-

10k+ parts

-

379

$0.531

-

-

-

Microchip USA

USA . 199 parts In-Stock

1+ parts

$3.315

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$3.315

-

-

-

Kepictronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,000

-

-

-

-

SupplyDigital Components

Austria . 7,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,009

-

-

-

-

Kulean Microsystems

USA . 6,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,262

-

-

-

-

Problanco Electronics

Mexico . 6,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,212

-

-

-

-

Continental Prestige Electronics

USA . 5,350 parts In-Stock

1+ parts

-

100+ parts

$0.487

1k+ parts

-

10k+ parts

-

5,350

-

$0.487

-

-

A-Z Elektronik GmbH

Germany . 4,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

-

-

-

-

TANS Electronics

Latvia . 4,553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,553

-

-

-

-

UHIMA Technologies

Türkiye . 93 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

93

-

-

-

-

Overview

Upgrade your power systems with the NDF06N62ZG by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. Manufactured by industry leader Onsemi, this N-CHANNEL FET offers a breakthrough in performance and efficiency. With a minimum DS Breakdown Voltage of 620V and a maximum Drain Current of 6A, this transistor is perfect for enhancing your system's capabilities. Say goodbye to inefficiency and hello to improved power management with the NDF06N62ZG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL polarity offers good conductivity and efficiency in electronic circuits, making it a reliable choice for power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speed and low power consumption, making it ideal for controlling power in electronic devices.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this FET can handle high voltage applications without the risk of damage, ensuring reliability and safety in operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the FET's conductivity, enabling precise power management and efficient performance.

Maximum Pulsed Drain Current (IDM): 20 A

The high pulsed drain current rating ensures that the FET can handle sudden surges in current without getting damaged, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 113 mJ

The high avalanche energy rating indicates that the FET can withstand transient voltage spikes, ensuring long-term reliability in high-power environments.

Maximum Drain Current (ID): 6 A

With a high drain current rating, this FET can efficiently carry currents up to 6A, making it suitable for various power applications.

Maximum Drain-Source On Resistance: 1.2 ohm

The low drain-source on resistance results in minimal power loss and improved efficiency in power management, making this FET a cost-effective choice for applications requiring low resistance.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising performance, making it suitable for use in harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) NDF06N62ZG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

113 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

20 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDF06N62ZG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17