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NDF04N62ZG

Onsemi

NDF04N62ZG by Onsemi

NDF04N62ZG by Onsemi is a Power FET with 620V DS Breakdown Voltage, 18A IDM, and 2Ω RDS(ON). It is an N-CHANNEL transistor for SWITCHING applications. The device operates in ENHANCEMENT MODE and has a max temperature of 150 °C.

Median Price

$0.379

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,334 parts In-Stock

1+ parts

-

100+ parts

$0.357

1k+ parts

$0.296

10k+ parts

$0.264

7,334

-

$0.357

$0.296

$0.264

Verical

USA . 7,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.330

7,050

-

-

$0.401

$0.330

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,093 parts In-Stock

1+ parts

$0.277

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2,093

$0.277

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Vyrian

USA . 6,835 parts In-Stock

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6,835

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Distributors (Availability)

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Corphita

USA . 1,852 parts In-Stock

1+ parts

$0.263

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-

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1,852

$0.263

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Corohmni

South Africa . 197 parts In-Stock

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$0.292

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197

$0.292

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Component Stockers USA

USA . 4,878 parts In-Stock

1+ parts

$0.300

100+ parts

$0.280

1k+ parts

$0.250

10k+ parts

-

4,878

$0.300

$0.280

$0.250

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$21.160

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283

$21.160

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Continental Prestige Electronics

USA . 7,334 parts In-Stock

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$0.268

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7,334

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$0.268

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SupplyDigital Components

Austria . 7,186 parts In-Stock

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TANS Electronics

Latvia . 7,039 parts In-Stock

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Kulean Microsystems

USA . 6,925 parts In-Stock

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Problanco Electronics

Mexico . 6,392 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Perfect Parts

USA . 708 parts In-Stock

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708

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UHIMA Technologies

Türkiye . 430 parts In-Stock

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430

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Overview

Experience high-quality performance and reliability with the NDF04N62ZG by Onsemi, a leading manufacturer in the industry. Perfect for switching applications, this N-CHANNEL Power FET offers unparalleled value with its built-in diode configuration, ensuring seamless operation. Whether you need efficient power management or reliable circuit protection, this transistor delivers with its enhanced mode operation and impressive breakdown voltage of 620V. Trust Onsemi for top-notch products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protects the circuit from voltage spikes, making this product versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in high-frequency circuits.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this FET can handle higher voltages without breakdown, making it suitable for high-power applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and integrate into electronic circuits efficiently.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a secure and reliable connection to the circuit board, ensuring stability during operation.

Maximum Pulsed Drain Current (IDM): 18 A

High pulsed drain current rating allows for handling sudden spikes in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 120 mJ

The high avalanche energy rating indicates the ability to withstand voltage spikes and transient events, ensuring long-term reliability.

No. of Terminals: 3

Simplifies the connection process and reduces complexity in circuit design.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy and secure mounting options for various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability in a compact form factor.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can withstand harsh environmental conditions.

Transistor Element Material: SILICON

Silicon-based FETs offer superior performance and reliability compared to other materials.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term performance.

Maximum Drain Current (ID): 4.4 A

A high drain current rating allows for handling higher power levels, making this FET suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 2 ohm

Low drain-source on resistance ensures minimal power loss and efficient operation in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and integration, making it easy to use in various applications.

Case Connection: ISOLATED

Isolated case connection provides protection against electrical interference and ensures safe operation in complex electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) NDF04N62ZG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (ID):

4.4 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NDF04N62ZG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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