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NDF03N80ZH

Onsemi

NDF03N80ZH by Onsemi

NDF03N80ZH by Onsemi is a Power FET with 800V DS Breakdown Voltage, 13A IDM, and 100mJ EAS. Ideal for applications requiring high power dissipation in enhancement mode operation. Suitable for use in circuits where N-CHANNEL configuration with built-in diode is needed.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,194 parts In-Stock

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Vyrian

USA . 816 parts In-Stock

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TANS Electronics

Latvia . 7,850 parts In-Stock

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7,850

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Kulean Microsystems

USA . 2,021 parts In-Stock

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Corphita

USA . 1,947 parts In-Stock

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UHIMA Technologies

Türkiye . 470 parts In-Stock

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470

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Problanco Electronics

Mexico . 275 parts In-Stock

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SupplyDigital Components

Austria . 114 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Looking to power up your electronic devices with reliability and efficiency? Look no further than the NDF03N80ZH by Onsemi. This N-CHANNEL Power Field Effect Transistor (FET) offers a high DS Breakdown Voltage of 800V, ensuring superior performance and durability. Its single configuration with built-in diode makes it ideal for a wide range of applications. With a maximum Drain Current of 3.3A and a Power Dissipation of 25W, this transistor provides unbeatable value and benefits to customers looking for top-notch quality in their electronics. Choose Onsemi for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs offer high input impedance and low output impedance, providing efficient switching and amplification capabilities.

Minimum DS Breakdown Voltage: 800 V

With a high breakdown voltage, this FET can handle high power applications safely and reliably.

Maximum Pulsed Drain Current (IDM): 13 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current without damage, making it suitable for dynamic applications.

Avalanche Energy Rating (EAS): 100 mJ

The high avalanche energy rating ensures the FET can withstand voltage spikes and surges, improving overall reliability.

Maximum Power Dissipation (Abs): 25 W

With a high power dissipation rating, this FET can efficiently handle and dissipate heat generated during operation, reducing the risk of overheating.

Maximum Operating Temperature: 150 °C

The FET can operate at high temperatures without performance degradation, making it suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) NDF03N80ZH attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

100 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

3.3 A

Maximum Drain Current (ID):

2.1 A

Maximum Drain-Source On Resistance:

4.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

13 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Trade Compliance

NDF03N80ZH Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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