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NCV7429DE5R2G

Onsemi

NCV7429DE5R2G by Onsemi

NCV7429DE5R2G by Onsemi is an AEC-Q100 compliant network interface with 20 terminals. It operates b/w -40 to 150 °C, suitable for automotive applications. Featuring a small outline package style, matte tin finish, and gull wing terminal form, it is ideal for telecom interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,225 parts In-Stock

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Flip Electronics

USA . 2,600 parts In-Stock

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Digiode

USA . 1,308 parts In-Stock

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AZTECH Wire

Italy . 953 parts In-Stock

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$17.020

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QUARKTWIN TECHNOLOGY LTD

USA . 21,003 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 6,772 parts In-Stock

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Kulean Microsystems

USA . 6,688 parts In-Stock

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Microchip USA

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Kepictronics

USA . 5,075 parts In-Stock

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Problanco Electronics

Mexico . 4,910 parts In-Stock

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TANS Electronics

Latvia . 4,471 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,480 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 630 parts In-Stock

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Vigor

Singapore . 444 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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Overview

Unlock the potential of your network interfaces with the NCV7429DE5R2G by Onsemi. Designed with quality and reliability in mind, this product offers a range of benefits and advantages for customers in various applications. From its durable package body material to its automotive temperature grade, this interface circuit ensures optimal performance in any environment. With Onsemi's reputation for excellence, you can trust that the NCV7429DE5R2G will deliver value and efficiency to your projects. Elevate your networking experience today with this top-of-the-line product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Being surface mountable makes installation easy and saves space in the design.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures high reliability and quality suitable for automotive applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Nominal Supply Voltage: 5 V

This product is designed to work efficiently with a nominal supply voltage of 5V, making it compatible with standard power sources.

Technical Specifications

Network Interfaces NCV7429DE5R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NCV7429DE5R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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