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NCV7381BDP0R2G

Onsemi

NCV7381BDP0R2G by Onsemi

NCV7381BDP0R2G by Onsemi is a FlexRay transceiver with 10 Mbps data rate, suitable for automotive applications. It operates at -40 to 125 °C temperature range and has a supply voltage of 5V. This network interface IC comes in a small outline package with 16 terminals and is AEC-Q100 qualified.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 58,000 parts In-Stock

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Vyrian

USA . 3,926 parts In-Stock

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Digiode

USA . 398 parts In-Stock

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398

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Distributors (Availability)

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Vigor

Singapore . 470 parts In-Stock

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$1.240

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470

$1.240

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Microchip USA

USA . 4,474 parts In-Stock

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$8.331

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4,474

$8.331

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AZTECH Wire

Italy . 368 parts In-Stock

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$14.120

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368

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Component Stockers USA

USA . 5,384 parts In-Stock

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$21.990

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$21.990

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TANS Electronics

Latvia . 8,158 parts In-Stock

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iodParts Technologies Inc.

India . 5,250 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 3,287 parts In-Stock

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Corphita

USA . 2,435 parts In-Stock

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Kulean Microsystems

USA . 1,992 parts In-Stock

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SupplyDigital Components

Austria . 1,473 parts In-Stock

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Corohmni

South Africa . 298 parts In-Stock

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UHIMA Technologies

Türkiye . 48 parts In-Stock

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Overview

The NCV7381BDP0R2G by Onsemi is a top-of-the-line network interface designed to deliver premium performance and reliability. Onsemi, a trusted manufacturer in the industry, ensures that this product meets the highest standards for quality and durability. Ideal for automotive applications, this flexray transceiver offers customers unmatched value with its advanced features and benefits. Upgrade your network interfaces with the NCV7381BDP0R2G and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and reliability to the network interface.

Surface Mount: YES

Being surface mountable allows for easier and more convenient installation of the network interface on circuit boards.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the network interface meets automotive industry standards for quality and reliability.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this network interface can withstand harsh environmental conditions.

Data Rate: 10 Mbps

The high data rate of 10 Mbps allows for fast and efficient communication within the network.

Technical Specifications

Network Interfaces NCV7381BDP0R2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

10 Mbps

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

6.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.99 mm

Maximum Supply Current:

37 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

NCV7381BDP0R2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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