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NCV7356D2G

Onsemi

NCV7356D2G by Onsemi

NCV7356D2G by Onsemi is an AEC-Q100 compliant network interface IC with 14 terminals, operating at -40 to 125 °C. It has a supply voltage range of 5-27V and data rate of 0.1 Mbps, suitable for automotive applications requiring high temperature tolerance and reliable communication in small outline packages.

Median Price

$0.672

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 30 parts In-Stock

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$0.711

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$0.632

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$0.607

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30

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Verical

USA . 30 parts In-Stock

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$0.632

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$0.607

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Chip Stock

USA . 64,000 parts In-Stock

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Vyrian

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VRG Components

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Digiode

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AZTECH Wire

Italy . 827 parts In-Stock

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$12.390

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Metaverse IC Inc.

Canada . 21,508 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,277 parts In-Stock

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Kulean Microsystems

USA . 6,702 parts In-Stock

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Microchip USA

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SupplyDigital Components

Austria . 4,958 parts In-Stock

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Problanco Electronics

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Perfect Parts

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TANS Electronics

Latvia . 725 parts In-Stock

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Vigor

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Corohmni

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Corphita

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UHIMA Technologies

Türkiye . 13 parts In-Stock

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Overview

The NCV7356D2G by Onsemi is a top-of-the-line network interface that guarantees unmatched quality and reliability. Manufactured by the reputable Onsemi brand, this product is designed to meet the rigorous AEC-Q100 screening level standards, making it ideal for automotive applications. With a wide range of features including a small outline package style, dual terminal position, and a high nominal supply voltage of 16V, the NCV7356D2G offers exceptional value and benefits to customers looking for a robust and efficient interface circuit solution. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the network interface lightweight and durable, ideal for automotive applications where weight is a concern.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and making assembly processes more streamlined.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, making this network interface suitable for automotive environments where robustness is crucial.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this network interface can withstand harsh automotive operating conditions without sacrificing performance.

Nominal Supply Voltage: 16 V

The 16V nominal supply voltage ensures compatibility with various automotive electrical systems, providing reliable power to the network interface.

Data Rate: 0.1 Mbps

Supporting a data rate of 0.1 Mbps, this network interface is suitable for transmitting low to medium amounts of data efficiently in automotive communication systems.

Technical Specifications

Network Interfaces NCV7356D2G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/27

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

NCV7356D2G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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