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NCV7356D2

Onsemi

NCV7356D2 by Onsemi

NCV7356D2 by Onsemi is an AEC-Q100 compliant network interface with 14 terminals, operating at -40 to 125 °C. It has a supply voltage of 5/27V and data rate of 0.1 Mbps, suitable for automotive applications requiring a compact small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 45,000 parts In-Stock

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Vyrian

USA . 9,426 parts In-Stock

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Digiode

USA . 787 parts In-Stock

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787

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Distributors (Availability)

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Component Stockers USA

USA . 715 parts In-Stock

1+ parts

$1.640

100+ parts

$1.560

1k+ parts

$1.510

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715

$1.640

$1.560

$1.510

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AZTECH Wire

Italy . 290 parts In-Stock

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$11.090

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290

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RC Electronics

USA . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,368 parts In-Stock

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Problanco Electronics

Mexico . 8,228 parts In-Stock

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TANS Electronics

Latvia . 8,084 parts In-Stock

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SupplyDigital Components

Austria . 7,449 parts In-Stock

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Assy Fe

Spain . 5,500 parts In-Stock

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Microchip USA

USA . 3,943 parts In-Stock

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Kulean Microsystems

USA . 1,646 parts In-Stock

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Corphita

USA . 1,089 parts In-Stock

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Vigor

Singapore . 948 parts In-Stock

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UHIMA Technologies

Türkiye . 373 parts In-Stock

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Corohmni

South Africa . 336 parts In-Stock

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336

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Overview

Enhance your automotive electronic systems with the NCV7356D2 by Onsemi. This high-quality network interface offers reliability and performance, meeting AEC-Q100 standards. Ideal for a wide range of applications, this product provides seamless connectivity and efficient data transmission. With its compact design and automotive-grade temperature durability, the NCV7356D2 ensures lasting functionality in challenging environments. Trust Onsemi's expertise in semiconductor manufacturing to deliver value and innovation to your projects. Experience the benefits of superior quality and reliability with the NCV7356D2 network interface.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation onto circuit boards.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive use.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance even in harsh automotive environments.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good solderability and electrical conductivity.

Width: 3.9 mm

The compact width enables space-saving design in automotive electronic systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product can withstand automotive temperature requirements.

Data Rate: 0.1 Mbps

The data rate of 0.1 Mbps is suitable for basic networking applications.

Technical Specifications

Network Interfaces NCV7356D2 attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.1 Mbps

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/27

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

16 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

NCV7356D2 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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