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NCV7340D12G

Onsemi

NCV7340D12G by Onsemi

NCV7340D12G by Onsemi is an automotive-grade network interface IC with 8 terminals and a supply voltage of 5V. It operates at temperatures ranging from -40 to 125 °C, with a data rate of 1 Mbps. This small outline package is ideal for interface circuit applications in the automotive industry.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,516 parts In-Stock

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Digiode

USA . 1,844 parts In-Stock

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Vigor

Singapore . 270 parts In-Stock

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$0.470

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270

$0.470

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AZTECH Wire

Italy . 1,142 parts In-Stock

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$17.990

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Problanco Electronics

Mexico . 6,647 parts In-Stock

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SupplyDigital Components

Austria . 6,148 parts In-Stock

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Kulean Microsystems

USA . 3,870 parts In-Stock

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TANS Electronics

Latvia . 2,326 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,425 parts In-Stock

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UHIMA Technologies

Türkiye . 227 parts In-Stock

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Microchip USA

USA . 224 parts In-Stock

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Perfect Parts

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Corohmni

South Africa . 67 parts In-Stock

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Overview

Unlock seamless communication and connectivity with the NCV7340D12G by Onsemi, a top-tier manufacturer known for its superior quality and reliability. As a part of the Network Interfaces category, this product offers unparalleled value and benefits to customers in various applications. Whether you're integrating it into automotive systems or telecommunications devices, this interface circuit provides exceptional performance in extreme temperatures while ensuring efficient power supplies and optimal data rates. Elevate your projects with the NCV7340D12G and experience unmatched functionality and convenience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and lightweight design, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on PCBs, saving space and simplifying assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making the product suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the PCB and easy integration into existing designs.

Power Supplies (V): 5

Operating at 5V provides compatibility with standard voltage requirements, making integration easier.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and functionality in a compact design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is ideal for applications where board real estate is limited.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance in varied environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for reliable operation in extreme cold environments.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers increased flexibility in circuit design and installation.

Maximum Seated Height: 1.7272 mm

Low maximum seated height allows for compact and low-profile designs.

Width: 3.937 mm

Narrow width enables space-efficient placement on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow temperature duration of 30 seconds, the product ensures optimal soldering performance.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260 °C ensures proper soldering and reliability during assembly.

Length: 4.9276 mm

Compact length contributes to space-saving design and ease of integration.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade makes the product suitable for use in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form provides reliable connections and ease of soldering during installation.

Maximum Supply Current: 0.075 mA

Low maximum supply current ensures energy efficiency and reduced power consumption.

Telecom IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, the product facilitates communication and data transfer between devices.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage for compatibility with various systems.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27mm offers sufficient spacing for easy soldering and connection.

Data Rate: 1 Mbps

Supports data rates of up to 1Mbps for fast and efficient data transmission.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates a moderate level of moisture sensitivity, suitable for standard handling and storage precautions.

Technical Specifications

Network Interfaces NCV7340D12G attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9276 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.7272 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.937 mm

Trade Compliance

NCV7340D12G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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