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NCV33164D-5R2

Onsemi

NCV33164D-5R2 by Onsemi

NCV33164D-5R2 by Onsemi is a Power Management IC with Vsup ranging from 1V to 10V. It features a Nominal Voltage of 5V, operating temperature from -40 °C to 125°C, and is designed for automotive applications. This small outline IC has 8 terminals, Gull Wing form, and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,593 parts In-Stock

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Digiode

USA . 1,991 parts In-Stock

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AZTECH Wire

Italy . 670 parts In-Stock

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$22.060

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670

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QUARKTWIN TECHNOLOGY LTD

USA . 26,946 parts In-Stock

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Problanco Electronics

Mexico . 6,649 parts In-Stock

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SupplyDigital Components

Austria . 6,139 parts In-Stock

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Kulean Microsystems

USA . 3,831 parts In-Stock

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TANS Electronics

Latvia . 1,214 parts In-Stock

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Corphita

USA . 795 parts In-Stock

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UHIMA Technologies

Türkiye . 282 parts In-Stock

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Corohmni

South Africa . 237 parts In-Stock

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Vigor

Singapore . 163 parts In-Stock

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Microchip USA

USA . 119 parts In-Stock

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Overview

Discover the power of efficiency and reliability with the NCV33164D-5R2 by Onsemi. As a leading manufacturer in the Power Management ICs category, Onsemi delivers high-quality solutions for various applications. With a small outline package style and automotive-grade temperature grade, this power supply support circuit offers unmatched performance and versatility. Experience peace of mind knowing your electronics are powered by Onsemi's top-of-the-line technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy installation on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 2.4 V

Optimal supply voltage for efficient power management and operation of the IC.

Power Supplies (V): 5

Supports a wide range of power supply voltages, making it versatile for different system requirements.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, ensuring reliability in harsh environments.

Technology: BIPOLAR

Bipolar technology offers high performance and precision in power management applications.

Technical Specifications

Power Management ICs NCV33164D-5R2 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.05 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

2.4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.33V

Width (mm):

3.9 mm

Trade Compliance

NCV33164D-5R2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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