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NCV33064P-5RAG

Onsemi

NCV33064P-5RAG by Onsemi

NCV33064P-5RAG by Onsemi is a Power Management IC with 3 terminals, operating voltage of 4-6.5V, and current of 0.5mA. It has a temperature range of -40 to 125 °C and is ideal for automotive power supply support circuits in cylindrical package style.

Median Price

$0.576

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 623 parts In-Stock

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$0.530

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623

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$0.530

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Rochester

USA . 313 parts In-Stock

1+ parts

-

100+ parts

$0.622

1k+ parts

$0.517

10k+ parts

$0.461

313

-

$0.622

$0.517

$0.461

Distributors (In-Stock)

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Digiode

USA . 1,897 parts In-Stock

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$0.484

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$0.484

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Vyrian

USA . 6,918 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 39 parts In-Stock

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$0.433

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39

$0.433

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Corphita

USA . 292 parts In-Stock

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$0.459

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292

$0.459

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Vigor

Singapore . 140 parts In-Stock

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$0.490

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140

$0.490

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Corohmni

South Africa . 196 parts In-Stock

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$0.510

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196

$0.510

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Component Stockers USA

USA . 906 parts In-Stock

1+ parts

$0.520

100+ parts

$0.490

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906

$0.520

$0.490

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Problanco Electronics

Mexico . 8,272 parts In-Stock

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TANS Electronics

Latvia . 8,086 parts In-Stock

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Kulean Microsystems

USA . 5,218 parts In-Stock

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Kepictronics

USA . 4,315 parts In-Stock

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SupplyDigital Components

Austria . 887 parts In-Stock

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Perfect Parts

USA . 739 parts In-Stock

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739

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UHIMA Technologies

Türkiye . 588 parts In-Stock

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Microchip USA

USA . 332 parts In-Stock

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Overview

Enhance your power management solutions with the NCV33064P-5RAG by Onsemi. With a focus on quality and reliability, Onsemi delivers cutting-edge Power Management ICs designed to meet the demands of various applications. This versatile product offers customers high value with its automotive-grade technology, ensuring optimal performance even in extreme temperatures. Trust Onsemi for superior power supply support circuits that provide efficiency and stability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Nominal Supply Voltage (Vsup): 4 V

The nominal supply voltage of 4V provides stable power to the device, ensuring consistent performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can withstand high temperatures, making it suitable for various environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish ensures good conductivity and reliability in connecting the device to the power source.

Technology: BIPOLAR

The bipolar technology used in this product offers efficient power management and control, enhancing the overall performance.

Technical Specifications

Power Management ICs NCV33064P-5RAG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBCY-T3

JESD-609 Code:

e3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.5 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

4 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+4.6V

Trade Compliance

NCV33064P-5RAG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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