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NCP81111MNDFTXG

Onsemi

NCP81111MNDFTXG by Onsemi

NCP81111MNDFTXG by Onsemi is a Power Management IC with 32 terminals, operating b/w -10 to 100 °C. It supports a nominal voltage of 5V and has an adjustable threshold feature. This chip carrier is suitable for power supply support circuits in various applications.

Median Price

$2.891

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,500 parts In-Stock

1+ parts

$2.891

100+ parts

$2.559

1k+ parts

$2.063

10k+ parts

$2.063

2,500

$2.891

$2.559

$2.063

$2.063

Chip1Stop

Japan . 2,500 parts In-Stock

1+ parts

$2.915

100+ parts

$2.184

1k+ parts

$2.130

10k+ parts

-

2,500

$2.915

$2.184

$2.130

-

DigiKey

USA . 17 parts In-Stock

1+ parts

$3.870

100+ parts

-

1k+ parts

-

10k+ parts

$2.096

17

$3.870

-

-

$2.096

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$2.559

1k+ parts

$2.063

10k+ parts

$2.063

2,500

-

$2.559

$2.063

$2.063

Rochester

USA . 148 parts In-Stock

1+ parts

-

100+ parts

$1.930

1k+ parts

$1.730

10k+ parts

$1.620

148

-

$1.930

$1.730

$1.620

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.200

-

-

-

DF Sales Co.

USA . 50 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$1.200

-

-

-

Digiode

USA . 2,014 parts In-Stock

1+ parts

$2.024

100+ parts

-

1k+ parts

-

10k+ parts

-

2,014

$2.024

-

-

-

Vyrian

USA . 2,804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,804

-

-

-

-

Conversion2

USA . 238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

238

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 450 parts In-Stock

1+ parts

$1.200

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$1.200

-

-

-

Corphita

USA . 1,650 parts In-Stock

1+ parts

$1.917

100+ parts

-

1k+ parts

-

10k+ parts

-

1,650

$1.917

-

-

-

SupplyDigital Components

Austria . 7,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,983

-

-

-

-

Kulean Microsystems

USA . 7,147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,147

-

-

-

-

Microchip USA

USA . 5,227 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,227

-

-

-

-

Speed Components Ltd (Excess)

Israel . 5,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,164

-

-

-

-

Problanco Electronics

Mexico . 5,076 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,076

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 3,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,805

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

TANS Electronics

Latvia . 540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

540

-

-

-

-

UHIMA Technologies

Türkiye . 95 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

95

-

-

-

-

Overview

Unlock the power of efficient and reliable Power Management ICs with the NCP81111MNDFTXG by Onsemi. Designed to meet the highest quality standards, this product offers unparalleled performance and versatility in a compact square package. Ideal for a wide range of applications, this chip carrier with heat sink/slug is a game-changer in power supply support circuits. With a nominal supply voltage of 5V and adjustable threshold, customers can trust in the value, benefits, and advantages that this innovative solution brings to their projects. Trust Onsemi for cutting-edge technology that delivers results.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation onto a circuit board, saving time and effort.

Package Shape: SQUARE

Square shape helps in efficient use of space on the circuit board.

Nominal Supply Voltage (Vsup): 5 V

Suitable for applications requiring a stable 5V supply voltage.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Provides efficient heat dissipation and compact design for space-constrained applications.

Maximum Operating Temperature: 100 °C

Can operate effectively in high-temperature environments.

Minimum Operating Temperature: -10 °C

Can operate in low-temperature conditions as well.

Terminal Finish: MATTE TIN

Provides a reliable and durable finish on the terminals.

Terminal Position: QUAD

Quad terminal position allows for efficient connectivity and signal transmission.

Width (mm): 5 mm

Compact width size allows for space-saving on the circuit board.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power management applications, ensuring optimal performance.

Minimum Supply Voltage (Vsup): 4.75 V

Provides a range of supply voltages for flexibility in different applications.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for the product to withstand reflow soldering processes.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during reflow soldering without damage.

Length: 5 mm

Compact length size helps in efficient space utilization.

Terminal Form: NO LEAD

Lead-free terminals comply with environmental regulations and are safer to use.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting on the circuit board.

Maximum Supply Voltage (Vsup): 5.25 V

Provides a safe operating voltage range for the product.

Adjustable Threshold: YES

Allows for customization of voltage thresholds as per application requirements.

Technical Specifications

Power Management ICs NCP81111MNDFTXG attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5 mm

Trade Compliance

NCP81111MNDFTXG Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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