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NCP391FCCADT2G

Onsemi

NCP391FCCADT2G by Onsemi

NCP391FCCADT2G by Onsemi is a Power Management IC with 6 terminals, operating voltage range of 1.2V to 28V, and low supply current of 0.17mA. It is designed for industrial applications requiring precise power supply support circuits in compact grid array package style.

Median Price

$0.512

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 564,000 parts In-Stock

1+ parts

-

100+ parts

$0.502

1k+ parts

$0.417

10k+ parts

$0.371

564,000

-

$0.502

$0.417

$0.371

Verical

USA . 564,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.521

10k+ parts

$0.464

564,000

-

-

$0.521

$0.464

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 84 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$0.410

-

-

-

Vyrian

USA . 7,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,405

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,197 parts In-Stock

1+ parts

$0.389

100+ parts

-

1k+ parts

-

10k+ parts

-

2,197

$0.389

-

-

-

Vigor

Singapore . 461 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$0.400

-

-

-

Corohmni

South Africa . 269 parts In-Stock

1+ parts

$0.432

100+ parts

-

1k+ parts

-

10k+ parts

-

269

$0.432

-

-

-

AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$15.150

100+ parts

-

1k+ parts

-

10k+ parts

-

546

$15.150

-

-

-

Continental Prestige Electronics

USA . 564,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.363

10k+ parts

-

564,000

-

-

$0.363

-

Kepictronics

USA . 111,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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111,000

-

-

-

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Kulean Microsystems

USA . 4,189 parts In-Stock

1+ parts

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100+ parts

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4,189

-

-

-

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SupplyDigital Components

Austria . 3,410 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,410

-

-

-

-

TANS Electronics

Latvia . 2,833 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,833

-

-

-

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Problanco Electronics

Mexico . 2,705 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,705

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 2,475 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,475

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UHIMA Technologies

Türkiye . 421 parts In-Stock

1+ parts

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1k+ parts

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421

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Microchip USA

USA . 393 parts In-Stock

1+ parts

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393

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-

Overview

Elevate your power management solutions with the NCP391FCCADT2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers quality and reliability in every product. The NCP391FCCADT2G falls under the category of Power Management ICs, offering versatile applications in various electronic devices. With its compact package design and advanced features, this IC provides value and efficiency to customers looking for superior performance. Trust Onsemi to power up your devices with the NCP391FCCADT2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that is commonly used in electronic components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard 5V power sources, making it easy to integrate into existing systems.

No. of Terminals: 6

Sufficient number of terminals for connections, providing flexibility in circuit design.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact and thin design with fine pitch terminals, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial environments, ensuring reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold environments without performance degradation.

Terminal Position: BOTTOM

Bottom terminal placement provides stability and ease of soldering during assembly.

Maximum Seated Height: 0.56 mm

Low-profile design saves space in compact electronic devices.

Width (mm): 1.04 mm

Slim and narrow width for efficient use of PCB space.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management applications, ensuring efficient and reliable power distribution.

Temperature Grade: INDUSTRIAL

Built to withstand harsh industrial environments, ensuring long-term performance and reliability.

Maximum Supply Current (Isup): 0.17 mA

Low power consumption for energy-efficient operation.

Terminal Form: BALL

Ball terminals provide secure connections and facilitate easy soldering.

Terminal Pitch: 0.4 mm

Fine pitch terminals allow for high density mounting on PCBs, saving space.

Maximum Supply Voltage (Vsup): 28 V

Supports a wide range of supply voltages for greater compatibility with different power sources.

Technical Specifications

Power Management ICs NCP391FCCADT2G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PBGA-B6

Length:

1.31 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA6,2X3,24/16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

4.2

Qualification:

Not Qualified

Maximum Seated Height:

.56 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.17 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width (mm):

1.04 mm

Trade Compliance

NCP391FCCADT2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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