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NCP305LSQ31T1G

Onsemi

NCP305LSQ31T1G by Onsemi

NCP305LSQ31T1G by Onsemi is a Power Management IC with 0.8-10V power supplies, -40 to 85°C operating temp range, and +3.1V nominal threshold voltage. It is used in industrial applications for power supply support circuits due to its small outline, thin profile package style and CMOS technology.

Median Price

$0.201

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,250 parts In-Stock

1+ parts

$0.130

100+ parts

-

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10k+ parts

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2,250

$0.130

-

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Rochester

USA . 9,468 parts In-Stock

1+ parts

$0.208

100+ parts

$0.195

1k+ parts

$0.176

10k+ parts

-

9,468

$0.208

$0.195

$0.176

-

DigiKey

USA . 304 parts In-Stock

1+ parts

$0.600

100+ parts

$0.356

1k+ parts

$0.301

10k+ parts

-

304

$0.600

$0.356

$0.301

-

Verical

USA . 2,250 parts In-Stock

1+ parts

-

100+ parts

$0.130

1k+ parts

-

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2,250

-

$0.130

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Chip1Stop

Japan . 2,250 parts In-Stock

1+ parts

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2,250

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Flip Electronics (Authorized)

USA . 1,237 parts In-Stock

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1,237

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Mouser Electronics

USA . 171 parts In-Stock

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$0.201

171

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-

$0.201

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,780 parts In-Stock

1+ parts

$0.124

100+ parts

-

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1,780

$0.124

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Vyrian

USA . 7,045 parts In-Stock

1+ parts

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7,045

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Flip Electronics

USA . 1,237 parts In-Stock

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1,237

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 574 parts In-Stock

1+ parts

$0.117

100+ parts

-

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574

$0.117

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Corohmni

South Africa . 363 parts In-Stock

1+ parts

$0.128

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363

$0.128

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Vigor

Singapore . 408 parts In-Stock

1+ parts

$0.590

100+ parts

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408

$0.590

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Continental Prestige Electronics

USA . 39,468 parts In-Stock

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$0.189

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39,468

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$0.189

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Lixinc

USA . 19,164 parts In-Stock

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Perfect Parts

USA . 6,720 parts In-Stock

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6,720

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Problanco Electronics

Mexico . 6,369 parts In-Stock

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6,369

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SupplyDigital Components

Austria . 5,561 parts In-Stock

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5,561

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Kulean Microsystems

USA . 3,733 parts In-Stock

1+ parts

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3,733

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TANS Electronics

Latvia . 530 parts In-Stock

1+ parts

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530

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Computer Components Inc. - USA

USA . 497 parts In-Stock

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497

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UHIMA Technologies

Türkiye . 407 parts In-Stock

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407

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Overview

Enhance your electronic devices with the NCP305LSQ31T1G by Onsemi, a high-quality power management IC that offers unmatched reliability and efficiency. Manufactured by Onsemi, a trusted name in the industry, this IC is designed to meet your power supply support circuit needs with ease. Perfect for a wide range of applications, this small outline, thin profile package provides stable power supplies ranging from 0.8V to 10V. Experience the convenience and performance that Onsemi products deliver, and elevate your projects to the next level with the NCP305LSQ31T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for various applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Compact design that fits well in electronic devices.

Power Supplies (V): 0.8/10

Wide range of power supply compatibility, suitable for different devices.

No. of Terminals: 4

Simple and easy connectivity for power management.

Maximum Operating Temperature: 85 °C

Can operate in high-temperature environments without performance issues.

Minimum Operating Temperature: -40 °C

Can operate in low-temperature environments without performance issues.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Allows for flexibility in mounting and connecting the IC.

Maximum Seated Height: 1.1 mm

Low profile design suitable for compact electronic devices.

Width (mm): 1.25 mm

Compact size for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power management, ensuring efficient and reliable operation.

Minimum Supply Voltage (Vsup): 0.8 V

Can operate at low voltage levels, suitable for energy-efficient applications.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes during assembly.

Length: 2 mm

Compact size for space-saving designs.

Nominal Threshold Voltage (V): +3.1V

Provides a stable reference voltage for power management.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with demanding temperature requirements.

Maximum Supply Current (Isup): 0.0036 mA

Low power consumption for energy-efficient operation.

Technology: CMOS

Efficient and reliable technology for power management circuits.

Terminal Form: GULL WING

Allows for easy soldering and strong mechanical connections.

Terminal Pitch: 1.3 mm

Standard pitch for easy PCB layout and manufacturing.

Maximum Supply Voltage (Vsup): 10 V

Can handle high voltage levels for versatile applications.

Technical Specifications

Power Management ICs NCP305LSQ31T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 3.1V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0036 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.1V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ31T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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