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NCP305LSQ26T1

Onsemi

NCP305LSQ26T1 by Onsemi

NCP305LSQ26T1 by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40 °C to 85°C. Ideal for power supply support circuits in various electronic devices.

Median Price

$0.110

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,355 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

24,355

-

$0.119

$0.099

$0.088

Avnet

USA . 24,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.100

10k+ parts

$0.100

24,355

-

-

$0.100

$0.100

Verical

USA . 24,355 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

24,355

-

-

-

$0.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 338 parts In-Stock

1+ parts

$0.093

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$0.093

-

-

-

Vyrian

USA . 2,555 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,555

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 276 parts In-Stock

1+ parts

$0.085

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$0.085

-

-

-

Corphita

USA . 2,495 parts In-Stock

1+ parts

$0.088

100+ parts

-

1k+ parts

-

10k+ parts

-

2,495

$0.088

-

-

-

Vigor

Singapore . 253 parts In-Stock

1+ parts

$0.090

100+ parts

-

1k+ parts

-

10k+ parts

-

253

$0.090

-

-

-

AZTECH Wire

Italy . 1,181 parts In-Stock

1+ parts

$20.150

100+ parts

-

1k+ parts

-

10k+ parts

-

1,181

$20.150

-

-

-

TANS Electronics

Latvia . 7,316 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,316

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-

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SupplyDigital Components

Austria . 6,635 parts In-Stock

1+ parts

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6,635

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-

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Kulean Microsystems

USA . 3,091 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,091

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-

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Problanco Electronics

Mexico . 1,255 parts In-Stock

1+ parts

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1,255

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Microchip USA

USA . 304 parts In-Stock

1+ parts

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304

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UHIMA Technologies

Türkiye . 133 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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133

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-

Overview

Elevate your power management game with the NCP305LSQ26T1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are reliable and efficient. This small outline, thin profile package offers a wide range of applications, providing customers with flexibility and versatility. With a nominal supply voltage of 1.5V and a temperature grade of industrial, this IC is perfect for various projects. Trust Onsemi to deliver high-performance products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving on space and production costs.

Nominal Supply Voltage (Vsup): 1.5 V

The low nominal supply voltage of 1.5V helps in reducing power consumption and increasing energy efficiency.

No. of Terminals: 4

Having a small number of terminals simplifies the connection process and PCB layout.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the product can withstand harsh environmental conditions.

Terminal Finish: TIN LEAD

The use of tin lead terminal finish ensures good solderability and reliability in electrical connections.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage of 0.8V enables the product to work efficiently even with low power sources.

Technology: CMOS

Utilizing CMOS technology offers high noise immunity, low power consumption, and compatibility with a wide range of devices.

Technical Specifications

Power Management ICs NCP305LSQ26T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.6V

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ26T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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