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NCP305LSQ09T1

Onsemi

NCP305LSQ09T1 by Onsemi

NCP305LSQ09T1 by Onsemi is a Power Management IC with Vsup range of 0.8-10V, suitable for industrial applications. It features small outline package style, CMOS technology, and operates b/w -40 to 85 °C. Ideal for power supply support circuits in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,095 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 5,136 parts In-Stock

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Digiode

USA . 1,683 parts In-Stock

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AZTECH Wire

Italy . 435 parts In-Stock

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$18.610

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Component Stockers USA

USA . 460 parts In-Stock

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$99.990

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RC Electronics

USA . 100,000 parts In-Stock

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SupplyDigital Components

Austria . 8,123 parts In-Stock

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Problanco Electronics

Mexico . 6,223 parts In-Stock

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TANS Electronics

Latvia . 4,878 parts In-Stock

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Kulean Microsystems

USA . 2,089 parts In-Stock

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Corphita

USA . 944 parts In-Stock

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Vigor

Singapore . 455 parts In-Stock

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UHIMA Technologies

Türkiye . 390 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Microchip USA

USA . 137 parts In-Stock

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Overview

Unlock the power of your devices with the NCP305LSQ09T1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are designed to optimize performance and efficiency. Whether you're looking to enhance battery life, regulate voltage, or improve overall system functionality, this product is the perfect solution. With a wide range of applications and reliable performance, the NCP305LSQ09T1 offers unmatched value and benefits for all your power management needs. Trust Onsemi to deliver innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the Power Management IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Nominal Supply Voltage (Vsup): 0.85 V

The low nominal supply voltage of 0.85V makes this Power Management IC suitable for low power applications, improving efficiency.

No. of Terminals: 4

Having only 4 terminals simplifies the integration of this Power Management IC into circuit designs and reduces complexity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this Power Management IC can withstand harsh environmental conditions without malfunctioning.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making this Power Management IC efficient and reliable.

Technical Specifications

Power Management ICs NCP305LSQ09T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 0.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e0

Length:

2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0024 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.9V

Width (mm):

1.25 mm

Trade Compliance

NCP305LSQ09T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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