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NCP304HSQ29T1G

Onsemi

NCP304HSQ29T1G by Onsemi

NCP304HSQ29T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0035mA, and V threshold of +2.9V. Ideal for industrial applications, it offers a compact rectangular package with dual terminals and operates b/w -40 to 85 °C.

Median Price

$0.232

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,946 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

29,946

-

$0.241

$0.200

$0.178

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.223

15,000

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-

-

$0.223

Distributors (In-Stock)

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Digiode

USA . 2,139 parts In-Stock

1+ parts

$0.188

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$0.188

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Vyrian

USA . 8,217 parts In-Stock

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8,217

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Bristol Electronics

USA . 5,904 parts In-Stock

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5,904

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Dan-Mar Components

USA . 5,904 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,935 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,495 parts In-Stock

1+ parts

$0.178

100+ parts

-

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1,495

$0.178

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Vigor

Singapore . 240 parts In-Stock

1+ parts

$0.190

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240

$0.190

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Corohmni

South Africa . 306 parts In-Stock

1+ parts

$0.198

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306

$0.198

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$9.787

100+ parts

$8.906

1k+ parts

$8.025

10k+ parts

-

450

$9.787

$8.906

$8.025

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AZTECH Wire

Italy . 1,151 parts In-Stock

1+ parts

$10.660

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$10.660

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Kepictronics

USA . 30,000 parts In-Stock

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Continental Prestige Electronics

USA . 29,946 parts In-Stock

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$0.165

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29,946

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$0.165

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Problanco Electronics

Mexico . 7,526 parts In-Stock

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TANS Electronics

Latvia . 4,552 parts In-Stock

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Perfect Parts

USA . 3,308 parts In-Stock

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Kulean Microsystems

USA . 1,987 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,477 parts In-Stock

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SupplyDigital Components

Austria . 1,232 parts In-Stock

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Glotronic Ltd.

UK . 1,182 parts In-Stock

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UHIMA Technologies

Türkiye . 879 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 189 parts In-Stock

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189

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Overview

Enhance your power management capabilities with the NCP304HSQ29T1G from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that provide reliable and efficient solutions for a wide range of applications. With a compact design and industrial-grade temperature specifications, this product offers unmatched value and performance. Trust Onsemi to deliver cutting-edge technology that meets your power supply support circuit needs. Choose the NCP304HSQ29T1G for superior power management solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 1.5 V

Optimal supply voltage for stable and efficient power management operations.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments or applications that require high heat tolerance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient performance.

Technical Specifications

Power Management ICs NCP304HSQ29T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP4,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0035 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.3 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

NCP304HSQ29T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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