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NCP303LSN40T1G

Onsemi

NCP303LSN40T1G by Onsemi

NCP303LSN40T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and CMOS technology. With an operating temperature range of -40°C to 125°C, it offers precise power supply support in compact dimensions.

Median Price

$0.363

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 874 parts In-Stock

1+ parts

$0.530

100+ parts

$0.265

1k+ parts

$0.205

10k+ parts

-

874

$0.530

$0.265

$0.205

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Rochester

USA . 1 parts In-Stock

1+ parts

-

100+ parts

$0.196

1k+ parts

$0.162

10k+ parts

$0.145

1

-

$0.196

$0.162

$0.145

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 531 parts In-Stock

1+ parts

$0.152

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-

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531

$0.152

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.181

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300

$0.181

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Vyrian

USA . 7,210 parts In-Stock

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7,210

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ComSIT Distribution GmbH

Germany . 2,512 parts In-Stock

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2,512

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A2Z Electronics, Inc.

USA . 285 parts In-Stock

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285

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Bristol Electronics

USA . 285 parts In-Stock

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$0.366

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$0.211

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285

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$0.366

$0.211

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Semi Source

USA . 33 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 39,867 parts In-Stock

1+ parts

$0.136

100+ parts

-

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39,867

$0.136

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Semicontronic

India . 39,518 parts In-Stock

1+ parts

$0.136

100+ parts

$0.133

1k+ parts

$0.132

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39,518

$0.136

$0.133

$0.132

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Corphita

USA . 1,173 parts In-Stock

1+ parts

$0.144

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1,173

$0.144

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Corohmni

South Africa . 82 parts In-Stock

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$0.160

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82

$0.160

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Argo Parts USA

USA . 5,203 parts In-Stock

1+ parts

$0.181

100+ parts

-

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$0.176

5,203

$0.181

-

-

$0.176

Continental Prestige Electronics

USA . 2,398 parts In-Stock

1+ parts

$0.181

100+ parts

-

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$0.177

2,398

$0.181

-

-

$0.177

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.181

100+ parts

$0.177

1k+ parts

$0.172

10k+ parts

$0.168

500

$0.181

$0.177

$0.172

$0.168

Aztec Data Supply Inc.

USA . 1,000 parts In-Stock

1+ parts

$0.285

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1,000

$0.285

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Vigor

Singapore . 779 parts In-Stock

1+ parts

$0.510

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779

$0.510

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AZTECH Wire

Italy . 1,197 parts In-Stock

1+ parts

$12.160

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1,197

$12.160

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RC Electronics

USA . 83,446 parts In-Stock

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Kepictronics

USA . 66,000 parts In-Stock

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Metaverse IC Inc.

Canada . 60,000 parts In-Stock

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Perfect Parts

USA . 45,911 parts In-Stock

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Infinite Electronics LLP (Excess)

. 39,006 parts In-Stock

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39,006

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Formix International (Excess)

India . 39,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,412 parts In-Stock

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Lixinc

USA . 14,374 parts In-Stock

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SupplyDigital Components

Austria . 7,617 parts In-Stock

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TANS Electronics

Latvia . 6,288 parts In-Stock

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Problanco Electronics

Mexico . 6,252 parts In-Stock

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Kulean Microsystems

USA . 3,756 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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ChipstoGo Electronic ltd

UK . 2,500 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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762

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iodParts Technologies Inc.

India . 641 parts In-Stock

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641

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Microchip USA

USA . 444 parts In-Stock

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444

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Overview

Enhance your power management system with the NCP303LSN40T1G from Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch Power Management ICs that are ideal for a wide range of applications. This small outline, thin profile IC offers customers the value of efficient power supply support circuitry with a nominal threshold voltage of +4V. With a temperature grade of automotive and a terminal pitch of 0.95mm, this IC provides the perfect solution for your power management needs. Trust Onsemi to provide you with the best in power management technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material offers good insulation properties and is lightweight, making the product durable and suitable for various applications.

Surface Mount: YES

Surface mount technology makes the product easy to install and allows for compact circuit design, saving space on the PCB.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable nominal supply voltage for power management applications, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to withstand harsh environmental conditions and ensures reliable performance.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and is suitable for battery-powered devices, making the product energy-efficient.

Technical Specifications

Power Management ICs NCP303LSN40T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN40T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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