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NCP303LSN24T1G

Onsemi

NCP303LSN24T1G by Onsemi

NCP303LSN24T1G by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0013mA, and V thresholds at +2.4V. Ideal for automotive applications due to its temperature grade and compact design with 5 terminals in a small outline package.

Median Price

$0.488

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 65 parts In-Stock

1+ parts

$0.488

100+ parts

-

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65

$0.488

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Flip Electronics

USA . 51,000 parts In-Stock

1+ parts

-

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51,000

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Chip Stock

USA . 16,800 parts In-Stock

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16,800

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Classic Components Corporation

USA . 15,551 parts In-Stock

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15,551

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Vyrian

USA . 8,700 parts In-Stock

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8,700

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Digiode

USA . 1,933 parts In-Stock

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1,933

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 399 parts In-Stock

1+ parts

$0.478

100+ parts

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399

$0.478

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Argo Parts USA

USA . 4,955 parts In-Stock

1+ parts

$0.488

100+ parts

-

1k+ parts

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10k+ parts

$0.473

4,955

$0.488

-

-

$0.473

Continental Prestige Electronics

USA . 2,488 parts In-Stock

1+ parts

$0.488

100+ parts

-

1k+ parts

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10k+ parts

$0.478

2,488

$0.488

-

-

$0.478

Bastille Electronics

Australia . 2,135 parts In-Stock

1+ parts

$0.488

100+ parts

$0.464

1k+ parts

$0.440

10k+ parts

$0.434

2,135

$0.488

$0.464

$0.440

$0.434

Vigor

Singapore . 357 parts In-Stock

1+ parts

$0.630

100+ parts

-

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357

$0.630

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Ampacity Inc.

Singapore . 1,358 parts In-Stock

1+ parts

$5.500

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1,358

$5.500

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Semicontronic

India . 1,226 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

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1,226

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 706 parts In-Stock

1+ parts

$18.414

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706

$18.414

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Perfect Parts

USA . 135,957 parts In-Stock

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135,957

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RC Electronics

USA . 81,783 parts In-Stock

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81,783

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Kepictronics

USA . 27,000 parts In-Stock

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27,000

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SupplyDigital Components

Austria . 8,250 parts In-Stock

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8,250

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Futuretech Components

Singapore . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Kulean Microsystems

USA . 5,580 parts In-Stock

1+ parts

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5,580

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TANS Electronics

Latvia . 1,571 parts In-Stock

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1,571

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Lixinc

USA . 1,174 parts In-Stock

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1,174

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Problanco Electronics

Mexico . 914 parts In-Stock

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914

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UHIMA Technologies

Türkiye . 473 parts In-Stock

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473

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Corphita

USA . 322 parts In-Stock

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322

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Microchip USA

USA . 194 parts In-Stock

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194

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Overview

Elevate your power management game with the NCP303LSN24T1G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers high-quality Power Management ICs that guarantee optimal performance and reliability. This versatile product is perfect for various applications, offering customers value, efficiency, and peace of mind. With its compact design and wide operating temperature range, the NCP303LSN24T1G is the ultimate solution for all your power supply support circuit needs. Upgrade to Onsemi today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package durable and resistant to external elements, ensuring the reliability of the Power Management IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V is suitable for various applications, providing flexibility in power management.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, the Power Management IC can withstand high temperature environments, making it suitable for demanding industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the Power Management IC energy efficient and reliable.

Technical Specifications

Power Management ICs NCP303LSN24T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.4V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.4V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN24T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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