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NCP303LSN16T1

Onsemi

NCP303LSN16T1 by Onsemi

NCP303LSN16T1 by Onsemi is a Power Management IC with 5 terminals, operating from -40 to 125 °C. It has a nominal voltage of 1.5V and supports power supply circuits. The IC is designed for automotive applications, featuring a small outline package with tin lead finish and dual terminal position.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

$0.251

1k+ parts

$0.208

10k+ parts

$0.186

2,880

-

$0.251

$0.208

$0.186

Verical

USA . 2,880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.232

2,880

-

-

-

$0.232

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$0.184

100+ parts

-

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-

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-

700

$0.184

-

-

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Digiode

USA . 2,312 parts In-Stock

1+ parts

$0.196

100+ parts

-

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2,312

$0.196

-

-

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Vyrian

USA . 8,352 parts In-Stock

1+ parts

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8,352

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Distributors (Availability)

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Corohmni

South Africa . 294 parts In-Stock

1+ parts

$0.184

100+ parts

-

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-

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294

$0.184

-

-

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Corphita

USA . 2,098 parts In-Stock

1+ parts

$0.185

100+ parts

-

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2,098

$0.185

-

-

-

Vigor

Singapore . 345 parts In-Stock

1+ parts

$0.200

100+ parts

-

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345

$0.200

-

-

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AZTECH Wire

Italy . 838 parts In-Stock

1+ parts

$10.780

100+ parts

-

1k+ parts

-

10k+ parts

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838

$10.780

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$11.658

100+ parts

$10.609

1k+ parts

$9.560

10k+ parts

-

70

$11.658

$10.609

$9.560

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Problanco Electronics

Mexico . 8,150 parts In-Stock

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8,150

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SupplyDigital Components

Austria . 6,770 parts In-Stock

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6,770

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Kulean Microsystems

USA . 5,341 parts In-Stock

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5,341

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TANS Electronics

Latvia . 3,520 parts In-Stock

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3,520

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Continental Prestige Electronics

USA . 2,880 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.188

10k+ parts

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2,880

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-

$0.188

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UHIMA Technologies

Türkiye . 446 parts In-Stock

1+ parts

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446

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Microchip USA

USA . 425 parts In-Stock

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425

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Perfect Parts

USA . 30 parts In-Stock

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30

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Overview

Experience the power of the NCP303LSN16T1 by Onsemi, a high-quality Power Management IC perfect for automotive applications. With Onsemi's reputation for reliability and innovation, this small outline, thin profile chip offers unparalleled performance and efficiency. From maintaining stable supply voltages to protecting circuits, this IC ensures your devices run smoothly and safely. Trust Onsemi to deliver cutting-edge technology that meets your power management needs with precision and excellence. Elevate your automotive electronics with the NCP303LSN16T1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and cost-effective packaging solution for the power management IC, ensuring reliable performance over time.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during the manufacturing process.

Nominal Supply Voltage (Vsup): 1.5 V

Suitable for a wide range of applications that require a stable power supply at 1.5 V.

Maximum Operating Temperature: 125 °C

Allows the power management IC to operate in a high-temperature environment without compromising its performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Power Management ICs NCP303LSN16T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 1.6V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.6V

Width (mm):

1.5 mm

Trade Compliance

NCP303LSN16T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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