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NCP302LSN20T1G

Onsemi

NCP302LSN20T1G by Onsemi

NCP302LSN20T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates in temperatures from -40 °C to 125°C. This CMOS technology IC has a matte tin finish and is surface mountable.

Median Price

$0.208

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 20,504 parts In-Stock

1+ parts

$0.208

100+ parts

$0.195

1k+ parts

$0.176

10k+ parts

-

20,504

$0.208

$0.195

$0.176

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 652 parts In-Stock

1+ parts

$0.198

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-

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652

$0.198

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Chip Stock

USA . 7,700 parts In-Stock

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7,700

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Flip Electronics

USA . 6,000 parts In-Stock

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6,000

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Vyrian

USA . 3,592 parts In-Stock

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3,592

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Distributors (Availability)

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Corphita

USA . 1,947 parts In-Stock

1+ parts

$0.187

100+ parts

-

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1,947

$0.187

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Corohmni

South Africa . 213 parts In-Stock

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$0.208

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213

$0.208

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Vigor

Singapore . 535 parts In-Stock

1+ parts

$0.630

100+ parts

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535

$0.630

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Advanced Electronics

New Zealand . 94 parts In-Stock

1+ parts

$12.428

100+ parts

$11.309

1k+ parts

$10.191

10k+ parts

-

94

$12.428

$11.309

$10.191

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AZTECH Wire

Italy . 1,090 parts In-Stock

1+ parts

$16.720

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1,090

$16.720

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Perfect Parts

USA . 55,160 parts In-Stock

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55,160

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TANS Electronics

Latvia . 8,122 parts In-Stock

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8,122

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Kepictronics

USA . 6,400 parts In-Stock

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6,400

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Kulean Microsystems

USA . 5,849 parts In-Stock

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5,849

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Problanco Electronics

Mexico . 4,519 parts In-Stock

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4,519

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SupplyDigital Components

Austria . 589 parts In-Stock

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589

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UHIMA Technologies

Türkiye . 386 parts In-Stock

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386

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Overview

Unlock the full potential of your power management needs with the NCP302LSN20T1G by Onsemi. Crafted with precision and expertise, this Power Management IC offers unparalleled quality and reliability that Onsemi is renowned for. Ideal for automotive applications, this small outline, thin profile IC provides a nominal supply voltage of 1.5V, ensuring efficient power supply support without compromising on performance. Experience the seamless integration and unmatched benefits this innovative product brings to your projects, setting new standards in power management solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the Power Management IC, making it a reliable choice for various applications.

Surface Mount: YES

The ability to surface mount this IC facilitates easy and efficient assembly on circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 1.5 V

The specified nominal supply voltage ensures compatibility with a wide range of devices, making this IC versatile for different power management applications.

No. of Terminals: 5

A limited number of terminals simplifies the installation process and reduces the likelihood of errors during setup, enhancing the usability of the IC.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can function reliably in demanding environments without the risk of overheating or performance degradation.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures extends the range of applications where this IC can be used effectively, ensuring performance even in extreme conditions.

Technology: CMOS

Utilizing CMOS technology allows for efficient power management and low power consumption, leading to improved energy efficiency and battery life in devices using this IC.

Technical Specifications

Power Management ICs NCP302LSN20T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.0V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP302LSN20T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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