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NCP301HSN27T1G

Onsemi

NCP301HSN27T1G by Onsemi

NCP301HSN27T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and operates b/w -40°C to 125°C. This CMOS technology IC supports power supply circuits efficiently.

Median Price

$0.162

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 132,000 parts In-Stock

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$0.162

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$0.162

Distributors (In-Stock)

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$0.326

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15

$0.326

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Cyclops Electronics Ltd

UK . 33,000 parts In-Stock

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33,000

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Vyrian

USA . 5,618 parts In-Stock

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5,618

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Speed Components Ltd

Israel . 2,880 parts In-Stock

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2,880

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Digiode

USA . 2,180 parts In-Stock

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Bristol Electronics

USA . 789 parts In-Stock

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$0.317

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$0.156

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789

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$0.317

$0.156

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Distributors (Availability)

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Ampacity Inc.

Singapore . 131,543 parts In-Stock

1+ parts

$0.138

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131,543

$0.138

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Corohmni

South Africa . 421 parts In-Stock

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$0.162

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421

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Argo Parts USA

USA . 4,324 parts In-Stock

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$0.326

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$0.316

4,324

$0.326

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$0.316

Vigor

Singapore . 164 parts In-Stock

1+ parts

$0.500

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164

$0.500

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Microchip USA

USA . 155 parts In-Stock

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$1.289

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155

$1.289

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AZTECH Wire

Italy . 135 parts In-Stock

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$17.770

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135

$17.770

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Component Stockers USA

USA . 694 parts In-Stock

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$99.990

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694

$99.990

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Perfect Parts

USA . 1,490,804 parts In-Stock

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1,490,804

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Continental Prestige Electronics

USA . 132,000 parts In-Stock

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$0.162

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$0.162

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ChipstoGo Electronic ltd

UK . 30,000 parts In-Stock

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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Futuretech Components

Singapore . 24,000 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Kepictronics

USA . 11,350 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,948 parts In-Stock

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6,948

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TANS Electronics

Latvia . 6,573 parts In-Stock

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Lixinc

USA . 6,504 parts In-Stock

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Problanco Electronics

Mexico . 5,724 parts In-Stock

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SupplyDigital Components

Austria . 3,727 parts In-Stock

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Kulean Microsystems

USA . 2,804 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,620 parts In-Stock

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Corphita

USA . 1,533 parts In-Stock

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UHIMA Technologies

Türkiye . 731 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$0.320

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$0.310

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$0.303

500

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$0.310

$0.303

Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Experience unparalleled power management with the NCP301HSN27T1G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-quality products that exceed expectations. This Power Management IC is perfect for a wide range of applications, offering optimal performance and reliability. With a focus on innovation and customer satisfaction, Onsemi delivers cutting-edge solutions that provide value, benefits, and advantages to customers. Upgrade your power management system today with the NCP301HSN27T1G and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making it a reliable choice for power management ICs.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate this IC into various electronic devices with limited space.

Nominal Supply Voltage (Vsup): 1.5 V

With a stable supply voltage of 1.5V, this IC can efficiently regulate power in a circuit.

Power Supplies (V): 0.8/10

This IC can accommodate a wide range of power supplies from 0.8V to 10V, making it versatile for different applications.

No. of Terminals: 5

The 5 terminals provide ample connectivity options, allowing for versatile connections in a circuit.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This compact package style saves space and enhances thermal performance in tight layouts.

Maximum Operating Temperature: 125 °C

With a high operating temperature, this IC can withstand harsh environments without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable operation even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and layout, optimizing connectivity options.

Maximum Seated Height: 1.1 mm

The low seated height makes this IC suitable for applications with limited vertical space.

Width (mm): 1.5 mm

The compact width of 1.5mm allows for easy integration into densely populated circuit boards.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed to support power supply circuits, ensuring efficient power management.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage of 0.8V enables operation in low-power environments without sacrificing performance.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C guarantees secure solder joints, enhancing product durability.

Length: 3 mm

The compact length of 3mm allows for efficient use of PCB space, ideal for small electronic devices.

Nominal Threshold Voltage (V): +2.7V

The nominal threshold voltage of +2.7V ensures stable and accurate power regulation in the circuit.

Temperature Grade: AUTOMOTIVE

This IC is designed for automotive applications, meeting industry standards for reliability and performance in vehicle electronics.

Maximum Supply Current (Isup): 0.0013 mA

With a maximum supply current of 0.0013mA, this IC offers efficient power consumption for energy-efficient designs.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this IC suitable for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and ensures reliable connections in the circuit.

Terminal Pitch: 0.95 mm

The tight terminal pitch of 0.95mm allows for compact layout designs and high-density mounting of components.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage of 10V makes this IC suitable for a wide range of applications requiring higher voltage levels.

Technical Specifications

Power Management ICs NCP301HSN27T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.7V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.7V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301HSN27T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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