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NCP301HSN22T1G

Onsemi

NCP301HSN22T1G by Onsemi

NCP301HSN22T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for automotive applications. It features a small outline package style, dual terminal position, and matte tin finish. With a wide operating temperature range of -40°C to 125°C, it offers reliable power supply support in compact designs.

Median Price

$0.256

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 60,232 parts In-Stock

1+ parts

-

100+ parts

$0.270

1k+ parts

$0.177

10k+ parts

-

60,232

-

$0.270

$0.177

-

Rochester

USA . 33,369 parts In-Stock

1+ parts

-

100+ parts

$0.241

1k+ parts

$0.200

10k+ parts

$0.178

33,369

-

$0.241

$0.200

$0.178

Verical

USA . 23,347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.223

23,347

-

-

-

$0.223

Element14

Singapore . 1,320 parts In-Stock

1+ parts

-

100+ parts

$0.610

1k+ parts

$0.400

10k+ parts

$0.362

1,320

-

$0.610

$0.400

$0.362

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,885 parts In-Stock

1+ parts

$0.188

100+ parts

-

1k+ parts

-

10k+ parts

-

1,885

$0.188

-

-

-

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

-

750

$0.236

-

-

-

Vyrian

USA . 6,066 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,066

-

-

-

-

Sea View Technologies

USA . 60 parts In-Stock

1+ parts

-

100+ parts

-

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60

-

-

-

-

Bristol Electronics

USA . 30 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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30

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 36,201 parts In-Stock

1+ parts

$0.168

100+ parts

-

1k+ parts

-

10k+ parts

-

36,201

$0.168

-

-

-

Corphita

USA . 835 parts In-Stock

1+ parts

$0.178

100+ parts

-

1k+ parts

-

10k+ parts

-

835

$0.178

-

-

-

Corohmni

South Africa . 429 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

-

429

$0.198

-

-

-

Component Stockers USA

USA . 41,561 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

41,561

$0.200

$0.190

$0.170

$0.170

Argo Parts USA

USA . 3,693 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

-

10k+ parts

$0.229

3,693

$0.236

-

-

$0.229

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.236

100+ parts

-

1k+ parts

$0.224

10k+ parts

$0.219

1,000

$0.236

-

$0.224

$0.219

Continental Prestige Electronics

USA . 1,325 parts In-Stock

1+ parts

$0.525

100+ parts

$0.270

1k+ parts

-

10k+ parts

-

1,325

$0.525

$0.270

-

-

Vigor

Singapore . 975 parts In-Stock

1+ parts

$0.630

100+ parts

-

1k+ parts

-

10k+ parts

-

975

$0.630

-

-

-

AZTECH Wire

Italy . 883 parts In-Stock

1+ parts

$18.200

100+ parts

-

1k+ parts

-

10k+ parts

-

883

$18.200

-

-

-

Perfect Parts

USA . 7,861 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,861

-

-

-

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Kulean Microsystems

USA . 7,829 parts In-Stock

1+ parts

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7,829

-

-

-

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SupplyDigital Components

Austria . 6,527 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,527

-

-

-

-

TANS Electronics

Latvia . 5,237 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,237

-

-

-

-

Problanco Electronics

Mexico . 2,123 parts In-Stock

1+ parts

-

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2,123

-

-

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Kepictronics

USA . 1,500 parts In-Stock

1+ parts

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100+ parts

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1,500

-

-

-

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Futuretech Components

Singapore . 694 parts In-Stock

1+ parts

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100+ parts

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694

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UHIMA Technologies

Türkiye . 472 parts In-Stock

1+ parts

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472

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-

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Microchip USA

USA . 174 parts In-Stock

1+ parts

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174

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-

Overview

Unlock the power of efficient energy management with the NCP301HSN22T1G by Onsemi. This high-quality Power Management IC offers a wide range of applications, from automotive to consumer electronics. With its reliable manufacturer and advanced technology, this IC provides customers with the value, benefits, and advantages they need for their projects. Trust in Onsemi to deliver top-notch performance and reliability with the NCP301HSN22T1G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort in the assembly process.

Nominal Supply Voltage (Vsup): 1.5 V

Ideal voltage for power management applications, ensuring compatibility with a wide range of devices.

Maximum Operating Temperature: 125 °C

Can operate efficiently in high temperature environments, making it suitable for various industrial and automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and performance of the power management IC.

Technical Specifications

Power Management ICs NCP301HSN22T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 2.2V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0013 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301HSN22T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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