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NCP301HSN09T1G

Onsemi

NCP301HSN09T1G by Onsemi

NCP301HSN09T1G by Onsemi is a Power Management IC with Vsup ranging from 0.8V to 10V, suitable for industrial applications. It features a small outline package style, dual terminal position, and operates b/w -40°C to 85°C. This CMOS technology IC has a matte tin finish and peak reflow temperature of 260°C.

Median Price

$0.277

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 900 parts In-Stock

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-

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$0.277

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$0.230

10k+ parts

$0.205

900

-

$0.277

$0.230

$0.205

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.203

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$0.203

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Digiode

USA . 1,006 parts In-Stock

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$0.217

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$0.217

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Flip Electronics

USA . 6,000 parts In-Stock

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Vyrian

USA . 2,517 parts In-Stock

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Cyclops Electronics Ltd

UK . 100 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 503 parts In-Stock

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$0.194

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503

$0.194

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Corohmni

South Africa . 368 parts In-Stock

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$0.199

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368

$0.199

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Argo Parts USA

USA . 1,545 parts In-Stock

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$0.203

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$0.197

1,545

$0.203

-

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$0.197

Continental Prestige Electronics

USA . 269 parts In-Stock

1+ parts

$0.203

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$0.199

269

$0.203

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$0.199

Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

$0.203

100+ parts

$0.193

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$0.183

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$0.181

50

$0.203

$0.193

$0.183

$0.181

Corphita

USA . 1,935 parts In-Stock

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$0.205

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Component Stockers USA

USA . 1,019 parts In-Stock

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$0.230

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$0.220

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$0.200

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$0.230

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Vigor

Singapore . 600 parts In-Stock

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$0.630

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$0.630

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AZTECH Wire

Italy . 355 parts In-Stock

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$14.701

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RC Electronics

USA . 72,917 parts In-Stock

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Kepictronics

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Perfect Parts

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Kulean Microsystems

USA . 7,697 parts In-Stock

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TANS Electronics

Latvia . 7,619 parts In-Stock

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Lixinc

USA . 5,365 parts In-Stock

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Problanco Electronics

Mexico . 4,910 parts In-Stock

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SupplyDigital Components

Austria . 4,055 parts In-Stock

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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Futuretech Components

Singapore . 694 parts In-Stock

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Microchip USA

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Overview

Discover the NCP301HSN09T1G by Onsemi, a high-quality Power Management IC that offers unparalleled reliability and performance. Manufactured by Onsemi, a trusted name in the industry, this IC is perfect for a wide range of applications. With its small outline, thin profile, and shrink pitch package style, this IC is easy to integrate into any project. Whether you need power supply support circuitry or voltage regulation, this IC delivers exceptional value and efficiency. Trust Onsemi for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable.

Surface Mount: YES

With surface mount capability, this product can be easily integrated into compact devices.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient placement and space utilization on PCBs.

Nominal Supply Voltage (Vsup): 0.85 V

The low nominal supply voltage ensures energy efficiency and reduced power consumption.

Power Supplies (V): 0.8/10

This wide range of power supply compatibility allows for versatile applications.

No. of Terminals: 5

The 5 terminals provide multiple connection points for enhanced flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this product suitable for compact designs with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in extreme cold climates.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability and long-term reliability.

Terminal Position: DUAL

The dual terminal position provides redundancy and reliability in connections.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for slim and sleek product designs.

Width (mm): 1.5 mm

The narrow width makes this product suitable for applications with space constraints.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This product acts as a power supply support circuit, enhancing the functionality of the overall system.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage ensures compatibility with various power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature helps in preventing heat damage during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering during manufacturing processes.

Length: 3 mm

The compact length of this product allows for space-saving integration in tight layouts.

Nominal Threshold Voltage (V): +0.9V

The nominal threshold voltage ensures accurate and stable voltage regulation.

Temperature Grade: INDUSTRIAL

The industrial temperature grade makes this product suitable for rugged and harsh environments.

Maximum Supply Current (Isup): 0.0012 mA

The low maximum supply current consumption contributes to energy efficiency in operations.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and ease of soldering.

Terminal Pitch: 0.95 mm

The narrow terminal pitch allows for precise connections in compact designs.

Maximum Supply Voltage (Vsup): 10 V

The high maximum supply voltage tolerance ensures compatibility with a wide range of power sources.

Technical Specifications

Power Management ICs NCP301HSN09T1G attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 0.9V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0012 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+0.9V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.5 mm

Trade Compliance

NCP301HSN09T1G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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