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NCP300LSN47T1

Onsemi

NCP300LSN47T1 by Onsemi

NCP300LSN47T1 by Onsemi is a Power Management IC with Vsup of 1.5V, Isup of 0.0014mA, and V threshold of +4.7V. Ideal for automotive applications due to its temperature grade and compact design in a small outline package.

Median Price

$0.229

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

15,000

-

$0.238

$0.197

$0.176

Verical

USA . 12,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.220

12,000

-

-

-

$0.220

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,327 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

2,327

$0.185

-

-

-

Vyrian

USA . 4,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,591

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 542 parts In-Stock

1+ parts

$0.176

100+ parts

-

1k+ parts

-

10k+ parts

-

542

$0.176

-

-

-

Vigor

Singapore . 244 parts In-Stock

1+ parts

$0.190

100+ parts

-

1k+ parts

-

10k+ parts

-

244

$0.190

-

-

-

Corohmni

South Africa . 187 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

-

187

$0.195

-

-

-

Component Stockers USA

USA . 16,979 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

16,979

$0.200

$0.190

$0.170

$0.170

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$4.952

100+ parts

$4.506

1k+ parts

$4.061

10k+ parts

-

200

$4.952

$4.506

$4.061

-

AZTECH Wire

Italy . 1,058 parts In-Stock

1+ parts

$9.430

100+ parts

-

1k+ parts

-

10k+ parts

-

1,058

$9.430

-

-

-

Kepictronics

USA . 24,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

24,000

-

-

-

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Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.178

10k+ parts

-

15,000

-

-

$0.178

-

Kulean Microsystems

USA . 7,673 parts In-Stock

1+ parts

-

100+ parts

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7,673

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Perfect Parts

USA . 6,720 parts In-Stock

1+ parts

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6,720

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A-Z Elektronik GmbH

Germany . 4,688 parts In-Stock

1+ parts

-

100+ parts

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4,688

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-

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Problanco Electronics

Mexico . 4,107 parts In-Stock

1+ parts

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100+ parts

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4,107

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-

-

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SupplyDigital Components

Austria . 4,076 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,076

-

-

-

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Cyclops Electronics Ltd (Excess)

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

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UHIMA Technologies

Türkiye . 715 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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715

-

-

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TANS Electronics

Latvia . 695 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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695

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-

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Microchip USA

USA . 461 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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461

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-

Overview

Elevate your power management solutions with the NCP300LSN47T1 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality Power Management ICs that are versatile and reliable. This small outline, thin profile IC with a shrink pitch package offers a wide range of applications in automotive settings, ensuring optimal performance in various conditions. With a nominal threshold voltage of +4.7V and a temperature grade suitable for automotive use, this product provides unmatched value and benefits to customers seeking efficient power supply support circuits. Experience the advantages of Onsemi's advanced technology and enhance your power management systems today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in the overall design.

Nominal Supply Voltage (Vsup): 1.5 V

The nominal supply voltage of 1.5V ensures compatibility with a wide range of electronic devices, offering flexibility in design and application.

No. of Terminals: 5

With 5 terminals, this power management IC provides multiple connection points for efficient power distribution and control.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliable performance even in demanding industrial or automotive environments.

Technology: CMOS

Utilizing CMOS technology, this power management IC offers low power consumption and high noise immunity, making it energy-efficient and reliable in operation.

Technical Specifications

Power Management ICs NCP300LSN47T1 attributes and parameters. Explore more Power Management ICs devices from Onsemi

Specs

Additional Features:

DETECTION THRESHOLD VOLTAGE IS 4.7V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e0

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

0.7/10

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.0014 mA

Maximum Supply Voltage (Vsup):

10 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.7V

Width (mm):

1.5 mm

Trade Compliance

NCP300LSN47T1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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