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NBXHGA017LNHTAG

Onsemi

NBXHGA017LNHTAG by Onsemi

NBXHGA017LNHTAG clock generator by Onsemi operates at a max output frequency of 156.25 MHz, suitable for industrial applications. With a package style of small outline and terminal pitch of 2.54 mm, it is designed for surface mount assembly with a temperature range from -40 to 85 °C.

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Lifecycle Status

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1k+

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Digiode

USA . 2,131 parts In-Stock

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Vyrian

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QUARKTWIN TECHNOLOGY LTD

USA . 20,393 parts In-Stock

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TANS Electronics

Latvia . 7,629 parts In-Stock

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Problanco Electronics

Mexico . 6,699 parts In-Stock

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SupplyDigital Components

Austria . 2,848 parts In-Stock

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Kulean Microsystems

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Corphita

USA . 1,901 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 98 parts In-Stock

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the NBXHGA017LNHTAG by Onsemi. Crafted with precision and expertise, this clock generator offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless synchronization and timing solutions. Trust in Onsemi's reputation for excellence and innovation to elevate your projects to new heights. Experience the value and benefits that this clock generator brings to your designs, ensuring efficiency and accuracy every time. Elevate your electronics with the NBXHGA017LNHTAG from Onsemi.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 2.625 V

Operating within this voltage range ensures stable performance without risk of damage.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the circuit board.

Maximum Output Clock Frequency: 156.25 MHz

Provides a high-frequency output for fast and accurate timing applications.

No. of Terminals: 6

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for installation in tight areas.

Minimum Supply Voltage: 2.375 V

Works efficiently even at low supply voltages, ensuring compatibility with various systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably even in extremely cold environments, providing flexibility in usage.

Terminal Position: DUAL

Dual terminal position allows for flexible placement and connectivity options.

Maximum Seated Height: 1.9 mm

Low seated height minimizes board space requirements and simplifies design.

Width: 5 mm

Compact width allows for efficient use of space on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures robustness during soldering processes.

Length: 7 mm

Optimal length for easy integration into circuit board layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range allows for reliable operation in harsh environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Versatile IC type capable of generating clock signals for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures compatibility with modern manufacturing processes.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance under varying load conditions.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connectivity and compatibility with existing components.

Technical Specifications

Clock Generators NBXHGA017LNHTAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

156.25 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXHGA017LNHTAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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