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NBXHBA017LNHTAG

Onsemi

NBXHBA017LNHTAG by Onsemi

CLOCK GENERATOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: SON; Package Shape: RECTANGULAR;

Median Price

$5.610

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10 parts In-Stock

1+ parts

-

100+ parts

$5.610

1k+ parts

$5.020

10k+ parts

$4.720

10

-

$5.610

$5.020

$4.720

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,116 parts In-Stock

1+ parts

$5.938

100+ parts

-

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-

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1,116

$5.938

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Vyrian

USA . 6,380 parts In-Stock

1+ parts

-

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6,380

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 896 parts In-Stock

1+ parts

$5.625

100+ parts

-

1k+ parts

-

10k+ parts

-

896

$5.625

-

-

-

Corohmni

South Africa . 62 parts In-Stock

1+ parts

$6.250

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-

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62

$6.250

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AZTECH Wire

Italy . 367 parts In-Stock

1+ parts

$16.580

100+ parts

-

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367

$16.580

-

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$27.847

100+ parts

$25.341

1k+ parts

$22.835

10k+ parts

-

500

$27.847

$25.341

$22.835

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TANS Electronics

Latvia . 5,947 parts In-Stock

1+ parts

-

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5,947

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Kulean Microsystems

USA . 5,720 parts In-Stock

1+ parts

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5,720

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SupplyDigital Components

Austria . 5,083 parts In-Stock

1+ parts

-

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5,083

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Problanco Electronics

Mexico . 4,911 parts In-Stock

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4,911

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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UHIMA Technologies

Türkiye . 521 parts In-Stock

1+ parts

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521

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Microchip USA

USA . 117 parts In-Stock

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117

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Perfect Parts

USA . 54 parts In-Stock

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54

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Technical Specifications

Clock Generators NBXHBA017LNHTAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

312.5 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Equivalence Code:

DILCC6,.2

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXHBA017LNHTAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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