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NBXHBA017LN1TAG

Onsemi

NBXHBA017LN1TAG by Onsemi

NBXHBA017LN1TAG clock generator by Onsemi operates at a max output frequency of 312.5 MHz with a supply voltage range of 2.97V to 3.63V. This small outline package is ideal for industrial applications requiring precise timing and clock generation, featuring a ceramic/metal-sealed co-fired body material and dual terminal position design.

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Vyrian

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Digiode

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Flip Electronics

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 1,078 parts In-Stock

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 20,360 parts In-Stock

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Perfect Parts

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Problanco Electronics

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Kulean Microsystems

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SupplyDigital Components

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Microchip USA

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Futuretech Components

Singapore . 705 parts In-Stock

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TANS Electronics

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Corphita

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Authorized Procurement Solutions

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Corohmni

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GreenTree Electronics

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UHIMA Technologies

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Overview

Enhance the performance of your electronic devices with the NBXHBA017LN1TAG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their clock generators. Ideal for a wide range of applications, this product offers seamless integration, precise timing, and efficient power management. Stay ahead of the competition and experience unparalleled value and benefits with the NBXHBA017LN1TAG. Trust Onsemi to deliver excellence in every product, making it the go-to choice for all your clock generator needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for industrial applications

Surface Mount: YES

Surface mount design allows for easy and efficient PCB assembly

Maximum Supply Voltage: 3.63 V

Supports a wide range of supply voltages, offering flexibility in design

Maximum Output Clock Frequency: 312.5 MHz

High output clock frequency enables the product to handle demanding applications

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures the product can perform in various environmental conditions

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity

Technical Specifications

Clock Generators NBXHBA017LN1TAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

312.5 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Equivalence Code:

DILCC6,.2

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

20 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXHBA017LN1TAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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