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NBXHGA053LN1TAG

Onsemi

NBXHGA053LN1TAG by Onsemi

NBXHGA053LN1TAG clock generator by Onsemi operates at a max output frequency of 50 MHz with a supply voltage range of 3.135V to 3.465V. This small outline package is ideal for industrial applications requiring precise timing and temperature tolerance, featuring a ceramic-metal sealed co-fired body material and CMOS technology. With surface mount capability and dual terminals, it offers reliable performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 4,481 parts In-Stock

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Digiode

USA . 2,283 parts In-Stock

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AZTECH Wire

Italy . 346 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,524 parts In-Stock

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SupplyDigital Components

Austria . 5,930 parts In-Stock

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Kulean Microsystems

USA . 5,104 parts In-Stock

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Microchip USA

USA . 3,026 parts In-Stock

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Problanco Electronics

Mexico . 2,350 parts In-Stock

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TANS Electronics

Latvia . 1,958 parts In-Stock

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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Corphita

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Corohmni

South Africa . 267 parts In-Stock

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Overview

Upgrade your devices with the NBXHGA053LN1TAG Clock Generator from Onsemi, a leading manufacturer known for high-quality components. This small outline package offers a maximum output clock frequency of 50 MHz, making it ideal for a wide range of applications in industrial settings. With a nominal supply voltage of 3.3V and dual terminal position, this versatile component provides reliable performance in challenging environments. Trust Onsemi to deliver superior products that enhance your systems' functionality and efficiency.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this clock generator suitable for long-term use in various applications.

Surface Mount: YES

Being surface mountable makes installation and integration of this clock generator onto PCBs convenient and efficient, saving space and reducing assembly time.

Maximum Supply Voltage: 3.465 V

The high maximum supply voltage tolerance of 3.465 V allows for flexibility and compatibility with a wide range of power supply configurations.

Maximum Output Clock Frequency: 50 MHz

With a maximum output clock frequency of 50 MHz, this clock generator is capable of providing high-speed clock signals for various digital devices and systems.

Maximum Operating Temperature: 85 °C

The clock generator's high maximum operating temperature of 85 °C ensures reliable performance even in harsh environmental conditions or industrial settings.

Technology: CMOS

Utilizing CMOS technology, this clock generator offers low power consumption, high noise immunity, and compatibility with a wide range of digital devices and circuits.

Technical Specifications

Clock Generators NBXHGA053LN1TAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

50 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXHGA053LN1TAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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