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NBXHGA019LN1TAG

Onsemi

NBXHGA019LN1TAG by Onsemi

NBXHGA019LN1TAG by Onsemi is a Clock Generator with 125 MHz output frequency, suitable for industrial applications. It operates b/w -40 to 85 °C and has a supply voltage range of 2.375-2.625 V. This CMOS technology device comes in a small outline package with 6 terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 8,398 parts In-Stock

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Digiode

USA . 306 parts In-Stock

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AZTECH Wire

Italy . 680 parts In-Stock

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$10.540

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680

$10.540

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Problanco Electronics

Mexico . 7,803 parts In-Stock

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Kulean Microsystems

USA . 6,409 parts In-Stock

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SupplyDigital Components

Austria . 4,856 parts In-Stock

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TANS Electronics

Latvia . 4,840 parts In-Stock

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Corphita

USA . 2,037 parts In-Stock

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Microchip USA

USA . 384 parts In-Stock

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UHIMA Technologies

Türkiye . 142 parts In-Stock

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Corohmni

South Africa . 92 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the NBXHGA019LN1TAG by Onsemi. This clock generator, made with top-quality materials and cutting-edge technology, offers precision timing for a wide range of applications. From ensuring seamless data transmission to optimizing power consumption, this product guarantees reliability and efficiency. Trust Onsemi's expertise in clock generators to take your projects to the next level. Unlock the potential of your devices with the NBXHGA019LN1TAG.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on the PCB.

Maximum Supply Voltage: 2.625 V

The high maximum supply voltage tolerance provides flexibility in power supply options.

Maximum Output Clock Frequency: 125 MHz

The high maximum output clock frequency enables efficient processing of data and timing requirements.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures consistent performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for improved performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage is ideal for compatibility with various digital systems and components.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy integration and connection with other components on the PCB.

Technical Specifications

Clock Generators NBXHGA019LN1TAG attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-CDSO-N6

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

125 MHz

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Trade Compliance

NBXHGA019LN1TAG Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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