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NB4L16MMNG

Onsemi

NB4L16MMNG by Onsemi

NB4L16MMNG by Onsemi is a square-shaped interface IC with 16 terminals, operating at industrial temperature grade. It has a max supply voltage of 3.8V and power supplies of 2.5/3.3V, suitable for applications requiring fast signal processing and low power consumption in various electronic devices. With a terminal pitch of 0.5mm and no lead terminal form, it offers high performance with a max receive delay of 0.265ns.

Median Price

$9.588

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 80 parts In-Stock

1+ parts

$6.159

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$6.159

-

-

-

Mouser Electronics

USA . 106 parts In-Stock

1+ parts

$10.950

100+ parts

$7.800

1k+ parts

$7.090

10k+ parts

$7.000

106

$10.950

$7.800

$7.090

$7.000

DigiKey

USA . 183 parts In-Stock

1+ parts

$11.740

100+ parts

$8.577

1k+ parts

$7.298

10k+ parts

$7.164

183

$11.740

$8.577

$7.298

$7.164

Chip1Stop

Japan . 123 parts In-Stock

1+ parts

$23.300

100+ parts

$13.900

1k+ parts

-

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123

$23.300

$13.900

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-

Rochester

USA . 26,314 parts In-Stock

1+ parts

-

100+ parts

$6.580

1k+ parts

$5.890

10k+ parts

$5.540

26,314

-

$6.580

$5.890

$5.540

Verical

USA . 10,477 parts In-Stock

1+ parts

-

100+ parts

$8.225

1k+ parts

$7.362

10k+ parts

$6.925

10,477

-

$8.225

$7.362

$6.925

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,234 parts In-Stock

1+ parts

$5.851

100+ parts

-

1k+ parts

-

10k+ parts

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2,234

$5.851

-

-

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Vyrian

USA . 7,315 parts In-Stock

1+ parts

-

100+ parts

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7,315

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Semi Source

USA . 3,422 parts In-Stock

1+ parts

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3,422

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Flip Electronics

USA . 2,091 parts In-Stock

1+ parts

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2,091

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ACDS - Activité Composants Distribution Service

France . 939 parts In-Stock

1+ parts

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100+ parts

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939

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

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300

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,326 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

-

10k+ parts

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6,326

$5.240

-

-

-

Corphita

USA . 1,826 parts In-Stock

1+ parts

$5.543

100+ parts

-

1k+ parts

-

10k+ parts

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1,826

$5.543

-

-

-

Corohmni

South Africa . 310 parts In-Stock

1+ parts

$6.159

100+ parts

-

1k+ parts

-

10k+ parts

-

310

$6.159

-

-

-

Component Stockers USA

USA . 17,690 parts In-Stock

1+ parts

$7.760

100+ parts

$7.300

1k+ parts

$6.590

10k+ parts

$6.590

17,690

$7.760

$7.300

$6.590

$6.590

QUARKTWIN TECHNOLOGY LTD

USA . 18,778 parts In-Stock

1+ parts

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18,778

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TANS Electronics

Latvia . 3,773 parts In-Stock

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3,773

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Problanco Electronics

Mexico . 3,550 parts In-Stock

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3,550

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Perfect Parts

USA . 3,367 parts In-Stock

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3,367

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SupplyDigital Components

Austria . 1,896 parts In-Stock

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1,896

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Kulean Microsystems

USA . 1,213 parts In-Stock

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1,213

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Cyclops Electronics Ltd (Excess)

UK . 939 parts In-Stock

1+ parts

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939

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Glotronic Ltd.

UK . 751 parts In-Stock

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751

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UHIMA Technologies

Türkiye . 501 parts In-Stock

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501

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Kepictronics

USA . 246 parts In-Stock

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246

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Authorized Procurement Solutions

USA . 123 parts In-Stock

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123

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GreenTree Electronics

Israel . 123 parts In-Stock

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123

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Overview

Experience the cutting-edge technology of the NB4L16MMNG by Onsemi, a top-tier manufacturer known for its superior quality and reliability. This interface IC offers seamless integration in various applications, providing customers with unmatched performance and efficiency. With a wide range of benefits such as low power consumption and high-speed operation, this product is the perfect choice for those seeking advanced solutions in the electronic industry. Elevate your projects to new heights with the NB4L16MMNG and discover the true value it brings to your work.

Feature Benefit Bullets

Surface Mount: YES

This allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Maximum Supply Voltage: 3.8 V

The high maximum supply voltage allows for flexibility in power supply options, making it suitable for a variety of applications.

Package Shape: SQUARE

The square package shape can help with space-saving on the circuit board, especially in compact designs.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages enhances compatibility and versatility in different systems.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of package styles offers thermal management options and ensures a compact design for space-constrained applications.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures compatibility with a wide range of power sources while maintaining stable operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature indicates robustness and reliability in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable performance even in extreme cold environments.

Terminal Finish: NICKEL GOLD PALLADIUM

The terminal finish provides excellent conductivity, corrosion resistance, and durability for long-term reliability.

Terminal Position: QUAD

The quad terminal position offers improved stability and robustness in the connection, enhancing overall performance.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim profile, making it suitable for compact designs and applications with space constraints.

Width: 3 mm

The compact width allows for efficient use of board space and facilitates integration into tight layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time indicates the durability of the component during soldering processes, ensuring reliability in manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures stability and integrity during the assembly process, leading to reliable performance.

Length: 3 mm

The short length contributes to a compact form factor, ideal for applications where space-saving is crucial.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide range of temperature conditions typically found in industrial environments.

Maximum Receive Delay: 0.265 ns

The low maximum receive delay ensures quick response times, essential for high-speed communication and data processing applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies and improves the soldering process, enhancing the reliability and durability of the connection.

Maximum Supply Current: 55 mA

The moderate maximum supply current ensures efficient power usage and helps in designing energy-efficient systems.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a stable operating point for the component, ensuring consistent performance across different scenarios.

Terminal Pitch: 0.5 mm

The tight terminal pitch enables high-density mounting on the PCB, facilitating compact and intricate design layouts.

Interface IC Type: INTERFACE CIRCUIT

Being specifically designed for interface circuit applications, this IC provides optimized performance and features for efficient data communication.

Technical Specifications

Other Function Interface ICs NB4L16MMNG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.265 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB4L16MMNG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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