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NB4L16MMNR2

Onsemi

NB4L16MMNR2 by Onsemi

NB4L16MMNR2 by Onsemi is a square-shaped interface IC with 16 terminals and a supply voltage range of 2.375V to 3.8V. Operating in industrial temperatures, it has a max seated height of 1mm and peak reflow temperature of 235 °C. This chip carrier is suitable for applications requiring very thin profile package styles and low power consumption up to 55mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,997 parts In-Stock

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Digiode

USA . 543 parts In-Stock

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AZTECH Wire

Italy . 649 parts In-Stock

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$8.160

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649

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TANS Electronics

Latvia . 6,141 parts In-Stock

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SupplyDigital Components

Austria . 4,602 parts In-Stock

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Kulean Microsystems

USA . 1,954 parts In-Stock

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Problanco Electronics

Mexico . 937 parts In-Stock

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UHIMA Technologies

Türkiye . 696 parts In-Stock

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Corphita

USA . 617 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 77 parts In-Stock

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Overview

Discover the powerful performance and reliability of the NB4L16MMNR2 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products with cutting-edge technology. This interface IC is perfect for a variety of applications, offering seamless integration and enhanced functionality. Experience the value and benefits that this product brings to your projects, from its compact design to its high efficiency and durability. Trust Onsemi to provide you with the best solutions for your electronic needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient assembly onto circuit boards, making it suitable for automated manufacturing processes.

Maximum Supply Voltage: 3.8 V

Can handle higher supply voltages, providing flexibility in power supply design.

Package Shape: SQUARE

Square shape helps in optimizing space utilization on the circuit board.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, making it versatile for different applications.

No. of Terminals: 16

Sufficient number of terminals for connecting to various components and interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile packaging offers thermal performance and space-saving qualities.

Minimum Supply Voltage: 2.375 V

Can operate with lower supply voltages, increasing compatibility with different systems.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operation even in extreme cold environments.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal position facilitates easier PCB layout and routing of connections.

Maximum Seated Height: 1 mm

Low-profile design helps in minimizing the overall height of the circuit board assembly.

Width: 3 mm

Compact width dimension enables space-efficient PCB designs.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance ensures robust soldering during assembly processes.

Length: 3 mm

Compact length dimension contributes to overall space savings on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments.

Maximum Receive Delay: 0.265 ns

Low receive delay enhances signal integrity and performance in data communication applications.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations for environmentally friendly manufacturing.

Maximum Supply Current: 55 mA

Moderate supply current requirement for power-efficient operation.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for high-density mounting on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, meeting the requirements of various communication protocols and standards.

Technical Specifications

Other Function Interface ICs NB4L16MMNR2 attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.265 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB4L16MMNR2 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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