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NB4L16MMN

Onsemi

NB4L16MMN by Onsemi

NB4L16MMN by Onsemi is a 16-terminal interface IC with a supply voltage range of 2.375V to 3.8V, suitable for industrial applications. It operates in temperatures from -40 °C to 85°C and has a max seated height of 1mm. With a peak reflow temperature of 235°C, it offers low power consumption at 55mA max supply current.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,573 parts In-Stock

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Digiode

USA . 429 parts In-Stock

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429

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AZTECH Wire

Italy . 111 parts In-Stock

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$19.020

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111

$19.020

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Component Stockers USA

USA . 236 parts In-Stock

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$99.990

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236

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Authorized Procurement Solutions

USA . 32,000 parts In-Stock

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32,000

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TANS Electronics

Latvia . 7,638 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,855 parts In-Stock

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5,855

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Kulean Microsystems

USA . 4,177 parts In-Stock

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SupplyDigital Components

Austria . 3,171 parts In-Stock

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Corphita

USA . 1,326 parts In-Stock

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Problanco Electronics

Mexico . 854 parts In-Stock

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854

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Microchip USA

USA . 255 parts In-Stock

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UHIMA Technologies

Türkiye . 191 parts In-Stock

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Corohmni

South Africa . 95 parts In-Stock

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Overview

Discover the impressive NB4L16MMN by Onsemi, a top-quality Other Function Interface IC that boasts superior performance and reliability. With Onsemi's renowned reputation for producing cutting-edge technology, this product offers unmatched value and benefits to customers. Ideal for a wide range of applications, this chip carrier with a very thin profile is designed to operate in industrial settings with a wide temperature range. Experience seamless integration and enhanced functionality with the NB4L16MMN, setting a new standard in interface circuit technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount feature allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Can handle higher supply voltages, providing flexibility in various applications.

Package Shape: SQUARE

Square package shape aids in efficient placement and routing on the PCB, optimizing space usage.

Power Supplies (V): 2.5/3.3

Supports multiple power supply options, making it compatible with a range of systems.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and interfaces, ensuring versatile functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles cater to different mounting and thermal requirements, enhancing application flexibility.

Minimum Supply Voltage: 2.375 V

Can operate at low supply voltages, suitable for power-sensitive applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, making it suitable for diverse applications.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and electrical conductivity, ensuring secure connections.

Terminal Position: QUAD

Quad terminal position facilitates easy PCB layout and soldering, enabling efficient manufacturing processes.

Maximum Seated Height: 1 mm

Low seated height minimizes board space requirements and allows for compact designs.

Width: 3 mm

Compact width dimension enables placement in tight spaces while maintaining connectivity.

Peak Reflow Temperature °C: 235

High peak reflow temperature withstands standard soldering processes, ensuring robust assembly.

Length: 3 mm

Short length dimension saves board space and supports compact layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Maximum Receive Delay: 0.265 ns

Low maximum receive delay ensures quick signal processing, enhancing system responsiveness.

Terminal Form: NO LEAD

No-lead terminal form eliminates lead-related issues such as solder fatigue, enhancing product reliability.

Maximum Supply Current: 55 mA

Supports moderate supply current requirements, suitable for various power consumption scenarios.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage simplifies power supply design and integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, ideal for compact PCB designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, ensuring seamless communication between different parts of a system.

Technical Specifications

Other Function Interface ICs NB4L16MMN attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e0

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.265 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

NB4L16MMN Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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