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NB4L16MMNR2G

Onsemi

NB4L16MMNR2G by Onsemi

NB4L16MMNR2G by Onsemi is a 16-terminal interface IC with a max supply voltage of 3.8V and operating temperature range of -40 to 85°C. It features a terminal pitch of 0.5mm, no-lead terminal form, and is suitable for industrial applications requiring very thin profile package style.

Median Price

$8.137

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,533 parts In-Stock

1+ parts

$11.640

100+ parts

$7.808

1k+ parts

$7.118

10k+ parts

$6.916

2,533

$11.640

$7.808

$7.118

$6.916

Rochester

USA . 2,925 parts In-Stock

1+ parts

-

100+ parts

$6.510

1k+ parts

$5.820

10k+ parts

$5.480

2,925

-

$6.510

$5.820

$5.480

Verical

USA . 2,925 parts In-Stock

1+ parts

-

100+ parts

$8.137

1k+ parts

$7.275

10k+ parts

$6.850

2,925

-

$8.137

$7.275

$6.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 590 parts In-Stock

1+ parts

$6.878

100+ parts

-

1k+ parts

-

10k+ parts

-

590

$6.878

-

-

-

Vyrian

USA . 2,441 parts In-Stock

1+ parts

$7.240

100+ parts

-

1k+ parts

-

10k+ parts

-

2,441

$7.240

-

-

-

Flip Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 100 parts In-Stock

1+ parts

$5.762

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.762

-

-

-

Ampacity Inc.

Singapore . 2,866 parts In-Stock

1+ parts

$6.150

100+ parts

-

1k+ parts

-

10k+ parts

-

2,866

$6.150

-

-

-

Corphita

USA . 581 parts In-Stock

1+ parts

$6.516

100+ parts

-

1k+ parts

-

10k+ parts

-

581

$6.516

-

-

-

Corohmni

South Africa . 301 parts In-Stock

1+ parts

$7.240

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$7.240

-

-

-

Microchip USA

USA . 4,427 parts In-Stock

1+ parts

$19.803

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

$19.803

-

-

-

Kulean Microsystems

USA . 2,926 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,926

-

-

-

-

Problanco Electronics

Mexico . 2,774 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,774

-

-

-

-

TANS Electronics

Latvia . 1,619 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,619

-

-

-

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SupplyDigital Components

Austria . 1,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,015

-

-

-

-

UHIMA Technologies

Türkiye . 834 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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834

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Experience unparalleled quality and innovation with the NB4L16MMNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge solutions for Other Function Interface ICs, ensuring top-notch performance and reliability. This product offers customers exceptional value with its advanced features and benefits, making it ideal for a wide range of applications. From its surface mount capability to its wide temperature range, the NB4L16MMNR2G provides unmatched advantages that cater to your needs. Elevate your projects with Onsemi's superior technology and unlock endless possibilities today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly process.

Maximum Supply Voltage: 3.8 V

Provides flexibility in power supply options for different applications.

Package Shape: SQUARE

Compact package shape helps in efficient utilization of board space.

Power Supplies (V): 2.5/3.3

Supports multiple power supply voltages, enhancing compatibility.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in a circuit.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles provide options for different mounting and cooling methods.

Minimum Supply Voltage: 2.375 V

Wide range of supply voltage support for various operation conditions.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperature conditions as well.

Terminal Finish: NICKEL GOLD PALLADIUM

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and connections.

Maximum Seated Height: 1 mm

Low profile design saves vertical space in electronic devices.

Width: 3 mm

Compact width allows for placement in tight spaces on a circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient time for reflow soldering process, ensuring proper and reliable connections.

Peak Reflow Temperature °C: 260

Handles high reflow temperatures without damage, suitable for lead-free soldering.

Length: 3 mm

Compact length complements the square package shape for space efficiency.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliability in harsh operating conditions.

Maximum Receive Delay: 0.265 ns

Low receive delay for quick signal processing, ideal for high-speed interface applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer to handle.

Maximum Supply Current: 55 mA

Moderate supply current requirement for efficient power consumption.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on PCBs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed to facilitate communication between different parts of a system.

Technical Specifications

Other Function Interface ICs NB4L16MMNR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Receive Delay:

.265 ns

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NB4L16MMNR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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