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NB3N511DR2G

Onsemi

NB3N511DR2G by Onsemi

NB3N511DR2G clock generator by Onsemi operates at a max output frequency of 200 MHz with supply voltages of 3.3/5V. This industrial-grade device in a small outline package is ideal for applications requiring precise timing and clock signal generation, such as communication systems and embedded devices.

Median Price

$2.360

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 372 parts In-Stock

1+ parts

-

100+ parts

$2.360

1k+ parts

$2.110

10k+ parts

$1.980

372

-

$2.360

$2.110

$1.980

Distributors (In-Stock)

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Digiode

USA . 896 parts In-Stock

1+ parts

$2.498

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896

$2.498

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Vyrian

USA . 7,170 parts In-Stock

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7,170

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Chip Stock

USA . 3,292 parts In-Stock

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Bristol Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Corphita

USA . 2,415 parts In-Stock

1+ parts

$2.367

100+ parts

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2,415

$2.367

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Corohmni

South Africa . 488 parts In-Stock

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$2.630

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488

$2.630

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AZTECH Wire

Italy . 738 parts In-Stock

1+ parts

$14.720

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738

$14.720

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Component Stockers USA

USA . 364 parts In-Stock

1+ parts

$99.990

100+ parts

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364

$99.990

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TANS Electronics

Latvia . 6,957 parts In-Stock

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6,957

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Problanco Electronics

Mexico . 3,953 parts In-Stock

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3,953

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kulean Microsystems

USA . 1,885 parts In-Stock

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1,885

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Perfect Parts

USA . 1,288 parts In-Stock

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1,288

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UHIMA Technologies

Türkiye . 483 parts In-Stock

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483

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Microchip USA

USA . 404 parts In-Stock

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404

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SupplyDigital Components

Austria . 60 parts In-Stock

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Overview

Enhance your electronic designs with the NB3N511DR2G clock generator by Onsemi. Crafted with precision and reliability, this product offers a seamless solution for generating clock signals in various applications. From ensuring optimal performance to enabling smooth synchronization, this clock generator delivers unparalleled value and benefits to customers. Trust in Onsemi's expertise in clock generators and elevate your projects with quality components that promise efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and less prone to damage.

Surface Mount: YES

Surface mounting allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.465 V

Supports a high supply voltage, providing flexibility for various power requirements in electronic devices.

Maximum Output Clock Frequency: 200 MHz

Capable of generating high-frequency clock signals, suitable for advanced electronic systems and applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges, ensuring stable performance in harsh environments.

Technical Specifications

Clock Generators NB3N511DR2G attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

Additional Features:

IT ALSO OPEARTES AT 5V NOMINAL SUPPLY

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

200 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Nominal Primary Clock/Crystal Frequency:

32 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

NB3N511DR2G Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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