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MTP50N03HDL

Onsemi

MTP50N03HDL by Onsemi

MTP50N03HDL by Onsemi is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 150A IDM, 1250mJ EAS, and 0.025 ohm RDS(ON). Operating in ENHANCEMENT MODE at up to 150 °C, it has a SILICON element and DRAIN case connection.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,622 parts In-Stock

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Vyrian

USA . 515 parts In-Stock

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SupplyDigital Components

Austria . 8,233 parts In-Stock

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TANS Electronics

Latvia . 5,985 parts In-Stock

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Kulean Microsystems

USA . 4,416 parts In-Stock

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Corphita

USA . 1,643 parts In-Stock

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UHIMA Technologies

Türkiye . 494 parts In-Stock

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Corohmni

South Africa . 441 parts In-Stock

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Problanco Electronics

Mexico . 392 parts In-Stock

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Overview

Upgrade your power systems with the MTP50N03HDL by Onsemi. Crafted with superior quality and reliability, this P-Channel Power FET offers exceptional performance in switching applications. With a high breakdown voltage of 30V and a maximum drain current of 50A, this transistor ensures efficient power management. Its single configuration with built-in diode makes installation a breeze, while its enhanced metal-oxide semiconductor technology guarantees long-lasting durability. Trust Onsemi to deliver cutting-edge solutions for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the FET, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their efficiency and low RDS(on) values, making them suitable for various applications where power efficiency is important.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can be useful in applications that require reverse voltage protection.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid switching speeds and high efficiency in power conversion.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltages without failure, providing a level of reliability in operation.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and placement on circuit boards, saving space and enabling efficient circuit design.

Terminal Form: THROUGH-HOLE

Through-hole terminals make it easy to solder and connect the FET to a circuit board, providing a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simple control of the transistor's conductivity, making them suitable for various applications where precise control is required.

Maximum Pulsed Drain Current (IDM): 150 A

With a high pulsed drain current rating of 150A, this FET can handle short duration high current spikes, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1250 mJ

The high avalanche energy rating of 1250mJ indicates the FET's ability to withstand voltage spikes and transient events, ensuring reliability in harsh operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy connection in a circuit, providing flexibility in circuit design and implementation.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers a secure and sturdy mounting option, ensuring stability in the assembly and operation of the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and efficiency in power switching applications, making this FET a reliable choice for demanding tasks.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand high temperatures, making it suitable for applications where heat dissipation is a concern.

Transistor Element Material: SILICON

Silicon is a common material used in transistor elements due to its efficiency and reliability, ensuring stable performance in various operating conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and electrical conductivity, ensuring a secure and reliable connection in the circuit.

Maximum Drain Current (ID): 50 A

With a maximum drain current of 50A, this FET can handle high continuous currents, making it suitable for applications that require sustained power delivery.

Maximum Drain-Source On Resistance: 0.025 ohm

The low drain-source on resistance of 0.025 ohms results in minimal power loss and efficient power conversion, enhancing the overall performance of the FET.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit connections and reduces the chances of errors during assembly, ensuring ease of use and reliability.

Case Connection: DRAIN

The drain case connection allows for easy heat dissipation and electrical isolation, ensuring stable operation of the FET even in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP50N03HDL attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1250 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.025 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP50N03HDL Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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