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MTP52N06V

Onsemi

MTP52N06V by Onsemi

MTP52N06V by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 182A Max Pulsed Drain Current, 0.022 ohm Max RDS(on), and 165W Max Power Dissipation. Suitable for high-power switching circuits in various electronic devices.

Median Price

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Lifecycle Status

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Chip Stock

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Rotakorn

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Bristol Electronics

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Metaverse IC Inc.

Canada . 5,018 parts In-Stock

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Kulean Microsystems

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Corphita

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Türkiye . 805 parts In-Stock

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Problanco Electronics

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Overview

Discover the power and reliability of the MTP52N06V by Onsemi, a top-of-the-line Power Field Effect Transistor. With a focus on quality and performance, Onsemi delivers cutting-edge technology that meets the highest industry standards. Ideal for switching applications, this N-channel transistor offers enhanced efficiency and durability. Experience the value of seamless functionality with the MTP52N06V, providing customers with unparalleled benefits and advantages in their electronic projects. Elevate your designs with Onsemi's trusted expertise and advanced solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching functionality in electronic circuits, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for switching applications, delivering reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 60 V

Suitable for applications requiring a voltage threshold of up to 60 volts, offering versatility in usage.

Terminal Form: THROUGH-HOLE

Facilitates easy soldering and installation onto circuit boards, ensuring a secure connection.

Operating Mode: ENHANCEMENT MODE

Enables efficient power management through enhancement mode operation, enhancing overall performance.

Maximum Pulsed Drain Current (IDM): 182 A

Can handle high currents during pulse operations, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 406 mJ

Withstands high energy levels during avalanche breakdown, providing reliability under extreme conditions.

Maximum Power Dissipation (Abs): 165 W

Has a high power dissipation capability, ensuring efficient heat distribution and long-term reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes MOSFET technology for enhanced performance and efficiency in electronic circuits.

Maximum Operating Temperature: 175 °C

Can operate effectively at high temperatures, offering reliability in various environmental conditions.

Maximum Drain-Source On Resistance: 0.022 ohm

Features low on-resistance for minimal power loss and improved efficiency in power applications.

Technical Specifications

Power Field Effect Transistors (FET) MTP52N06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

406 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

52 A

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.022 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

182 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP52N06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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