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MTP5P06V

Onsemi

MTP5P06V by Onsemi

The Onsemi MTP5P06V is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 18A IDM and 125mJ EAS, operating in ENHANCEMENT MODE. With a max power dissipation of 40W and 0.45 ohm RDS(on), it offers reliable performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,480 parts In-Stock

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2,480

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Vyrian

USA . 1,063 parts In-Stock

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1,063

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Semi Source

USA . 3 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,956 parts In-Stock

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6,956

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TANS Electronics

Latvia . 5,898 parts In-Stock

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5,898

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Problanco Electronics

Mexico . 4,398 parts In-Stock

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4,398

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 3,554 parts In-Stock

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Kulean Microsystems

USA . 2,819 parts In-Stock

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Corphita

USA . 1,517 parts In-Stock

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Corohmni

South Africa . 410 parts In-Stock

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UHIMA Technologies

Türkiye . 87 parts In-Stock

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Assy Fe

Spain . 20 parts In-Stock

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Overview

Unleash the power of innovation with the MTP5P06V by Onsemi! This P-Channel Power Field Effect Transistor (FET) offers unparalleled quality and reliability, making it a top choice for switching applications. With a built-in diode and a 60V breakdown voltage, this transistor delivers superior performance and efficiency. Whether you're looking to enhance your electronic projects or boost your power systems, the MTP5P06V is the perfect solution. Trust Onsemi's expertise and elevate your designs with this high-quality transistor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are suitable for applications where a negative voltage is required, making this product versatile in various circuit designs.

Minimum DS Breakdown Voltage: 60 V

With a high minimum breakdown voltage of 60V, this FET can handle high voltage applications without risk of damage, ensuring reliable performance.

Maximum Drain Current (ID): 5 A

The high maximum drain current of 5A allows the FET to handle high current loads, making it suitable for power switching applications.

Maximum Power Dissipation (Abs): 40 W

The high power dissipation rating of 40W ensures that the FET can handle high power levels without overheating, contributing to its reliability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high efficiency and fast switching speeds, making this FET ideal for switching applications that require quick response times.

Technical Specifications

Power Field Effect Transistors (FET) MTP5P06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

125 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

5 A

Maximum Drain Current (ID):

5 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTP5P06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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