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MTB2N40E

Onsemi

MTB2N40E by Onsemi

The Onsemi MTB2N40E is a N-CHANNEL FET with 2A ID and 40W power dissipation. Ideal for applications requiring high drain current and operating temperature up to 150 °C, such as power management systems in automotive or industrial electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,328 parts In-Stock

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Vyrian

USA . 754 parts In-Stock

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Problanco Electronics

Mexico . 6,254 parts In-Stock

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TANS Electronics

Latvia . 3,500 parts In-Stock

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Kulean Microsystems

USA . 3,280 parts In-Stock

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SupplyDigital Components

Austria . 511 parts In-Stock

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UHIMA Technologies

Türkiye . 401 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Corphita

USA . 59 parts In-Stock

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Overview

Power up your devices with the MTB2N40E by Onsemi! As a leading manufacturer in power field effect transistors, Onsemi delivers top-notch quality and reliability. This N-channel FET offers a single configuration with an enhancement mode for optimal performance. With a maximum drain current of 2A and power dissipation of 40W, this transistor is perfect for a wide range of applications. Trust Onsemi to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are commonly used in power applications due to their high efficiency and low on-state resistance.

Configuration: SINGLE

Single configuration FETs are simpler to use and typically have lower cost compared to dual or multiple configuration FETs.

Surface Mount: YES

Surface mount FETs are easier to solder onto printed circuit boards and take up less space, making them ideal for compact designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are turned on by a positive voltage signal, providing better control over the switching operation.

Maximum Drain Current (Abs): 2 A

The high maximum drain current rating allows the FET to handle higher current loads, making it suitable for various power applications.

Maximum Power Dissipation (Abs): 40 W

With a high power dissipation rating, this FET can handle power levels efficiently without overheating, ensuring reliable operation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer good performance characteristics such as fast switching speeds and high input impedance.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate reliably in demanding environments without thermal issues.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliability, ensuring secure connections in electronic circuits.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows the FET to withstand soldering processes, ensuring proper assembly during manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) MTB2N40E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e0

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Trade Compliance

MTB2N40E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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