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MTB29N15ET4

Onsemi

MTB29N15ET4 by Onsemi

MTB29N15ET4 by Onsemi is a N-CHANNEL FET with 150V DS Breakdown Voltage, 102A IDM, and 0.07 ohm RDS(on). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 125W and can withstand temperatures up to 150 °C.

Median Price

$1.712

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 47,200 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.370

10k+ parts

$1.290

47,200

-

$1.530

$1.370

$1.290

DigiKey

USA . 47,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.010

10k+ parts

-

47,200

-

-

$2.010

-

Verical

USA . 47,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.712

10k+ parts

$1.613

47,200

-

-

$1.712

$1.613

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,011 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

1,011

$1.410

-

-

-

Digiode

USA . 1,881 parts In-Stock

1+ parts

$1.624

100+ parts

-

1k+ parts

-

10k+ parts

-

1,881

$1.624

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 300 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$1.410

-

-

-

Corphita

USA . 2,042 parts In-Stock

1+ parts

$1.539

100+ parts

-

1k+ parts

-

10k+ parts

-

2,042

$1.539

-

-

-

Continental Prestige Electronics

USA . 47,200 parts In-Stock

1+ parts

-

100+ parts

$1.570

1k+ parts

-

10k+ parts

-

47,200

-

$1.570

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,477 parts In-Stock

1+ parts

-

100+ parts

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13,477

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-

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Kulean Microsystems

USA . 7,867 parts In-Stock

1+ parts

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100+ parts

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7,867

-

-

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SupplyDigital Components

Austria . 7,266 parts In-Stock

1+ parts

-

100+ parts

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7,266

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-

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A-Z Elektronik GmbH

Germany . 6,266 parts In-Stock

1+ parts

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100+ parts

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6,266

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-

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Microchip USA

USA . 5,891 parts In-Stock

1+ parts

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5,891

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TANS Electronics

Latvia . 2,752 parts In-Stock

1+ parts

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2,752

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Problanco Electronics

Mexico . 1,576 parts In-Stock

1+ parts

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100+ parts

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1,576

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UHIMA Technologies

Türkiye . 881 parts In-Stock

1+ parts

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100+ parts

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881

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Overview

Unleash the power of innovation with the MTB29N15ET4 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor is designed to elevate your switching applications with ease. Its N-CHANNEL configuration and built-in diode ensure seamless performance, while its metal-oxide semiconductor technology guarantees optimal efficiency. Experience superior quality and reliability like never before, as you harness the full potential of this transistor for all your power needs. Upgrade to the MTB29N15ET4 today and revolutionize the way you operate.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection to the transistor, making it suitable for various applications in different environments.

Polarity or Channel Type: N-CHANNEL

N-Channel transistors typically have lower conduction losses and higher efficiency compared to P-Channel transistors, making them a good choice for many switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse currents, making the transistor more versatile and reliable.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low on-resistance for efficient performance.

Surface Mount: YES

Surface mount packaging allows for easy and compact integration onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and efficient use of space on circuit boards.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and secure connections, ensuring reliable performance in demanding conditions.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off and require a positive voltage to turn on, offering better control and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 102 A

The high pulsed drain current rating allows for temporary surges in current, ensuring safe operation under peak load conditions.

Avalanche Energy Rating (EAS): 421 mJ

The high avalanche energy rating indicates the transistor's ability to withstand high energy transient events, providing reliability in rugged conditions.

Maximum Drain Current (Abs) (ID): 29 A

With a high drain current rating, this transistor can handle high current loads, making it suitable for power applications.

No. of Terminals: 2

The 2-terminal configuration simplifies circuit design and installation, making this transistor easy to use in various applications.

Maximum Power Dissipation (Abs): 125 W

The high power dissipation rating ensures the transistor can handle high power levels without overheating, providing long-term reliability.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs in space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor suitable for energy-efficient applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures without compromising performance, ensuring reliability in harsh environments.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its reliability and performance, making this transistor a durable and efficient choice.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and corrosion resistance, ensuring reliable connections and long-term performance.

Maximum Drain-Source On Resistance: 0.07 ohm

The low on-resistance of the transistor results in minimal power loss and high efficiency, making it ideal for power switching applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, allowing for easy integration into circuit designs.

Case Connection: DRAIN

The drain case connection allows for efficient heat dissipation and helps in maintaining low operating temperatures for optimal performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature indicates the transistor's ability to withstand reflow soldering processes, ensuring reliable solder joints and long-term performance.

Technical Specifications

Power Field Effect Transistors (FET) MTB29N15ET4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

421 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

29 A

Maximum Drain Current (ID):

29 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

102 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB29N15ET4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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