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MTB23P06V

Onsemi

MTB23P06V by Onsemi

The Onsemi MTB23P06V is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 81A and EAS of 794mJ, operating in ENHANCEMENT MODE. With a max ID of 23A and 0.12 ohm RDS(on), it offers high power dissipation up to 90W in a small outline package.

Median Price

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Lifecycle Status

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9

In-Stock Inventory

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Vyrian

USA . 899 parts In-Stock

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Digiode

USA . 693 parts In-Stock

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EPE Components Inc.

USA . 620 parts In-Stock

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Bristol Electronics

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PC Components Company LLC

USA . 40 parts In-Stock

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Sogenti Electronics

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Q Components

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LittleDiode

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Flex Direct, LLC

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Kepictronics

USA . 27,860 parts In-Stock

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Authorized Procurement Solutions

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A-Z Elektronik GmbH

Germany . 7,458 parts In-Stock

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TANS Electronics

Latvia . 7,400 parts In-Stock

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SupplyDigital Components

Austria . 4,325 parts In-Stock

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Kulean Microsystems

USA . 3,788 parts In-Stock

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Problanco Electronics

Mexico . 3,607 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 356 parts In-Stock

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Corohmni

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Overview

Experience the power of innovation with the Onsemi MTB23P06V Power FET. Designed for high-performance switching applications, this P-Channel transistor offers top-notch quality and reliability. With a built-in diode and enhanced mode operation, it delivers seamless functionality. Whether you're upgrading your electronic devices or optimizing power management systems, this transistor is the perfect choice. Trust Onsemi for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making the product long-lasting.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their lower ON-state resistance and better efficiency compared to N-channel FETs, making this product a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the efficiency of the switching process and protects the circuit from voltage spikes, improving overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures smooth and reliable operation in various circuit designs.

Surface Mount: YES

The surface mount feature enables easy and compact integration onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without damage, ensuring reliability in demanding applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board and easy handling during installation.

Terminal Form: GULL WING

The gull wing terminal form offers secure connections and ease of soldering, contributing to the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simple control and high switching speeds, making them suitable for various applications including power management.

Maximum Pulsed Drain Current (IDM): 81 A

With a high pulsed drain current rating, this FET can handle sudden surges in power without compromising performance or reliability.

Technical Specifications

Power Field Effect Transistors (FET) MTB23P06V attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

794 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

23 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.12 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

81 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

MTB23P06V Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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