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MJD122TF

Onsemi

MJD122TF by Onsemi

MJD122TF by Onsemi is a NPN BJT with 100V VCEO, 8A IC, and 20W Ptot. Ideal for power applications, it features a built-in diode and resistor in a small outline package suitable for surface mount technology. Operating up to 150°C, it's commonly used in various electronic circuits.

Median Price

$0.315

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.315

100+ parts

-

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500

$0.315

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Chip Stock

USA . 5,500 parts In-Stock

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-

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5,500

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Digiode

USA . 2,393 parts In-Stock

1+ parts

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2,393

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Classic Components Corporation

USA . 1,643 parts In-Stock

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1,643

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Bristol Electronics

USA . 1,638 parts In-Stock

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1,638

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Vyrian

USA . 241 parts In-Stock

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241

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 374 parts In-Stock

1+ parts

$0.309

100+ parts

-

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374

$0.309

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Argo Parts USA

USA . 2,783 parts In-Stock

1+ parts

$0.315

100+ parts

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$0.306

2,783

$0.315

-

-

$0.306

Continental Prestige Electronics

USA . 2,078 parts In-Stock

1+ parts

$0.315

100+ parts

-

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$0.309

2,078

$0.315

-

-

$0.309

Netroflash

USA . 50 parts In-Stock

1+ parts

$0.315

100+ parts

-

1k+ parts

$0.300

10k+ parts

$0.293

50

$0.315

-

$0.300

$0.293

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.322

100+ parts

$0.322

1k+ parts

$0.322

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100

$0.322

$0.322

$0.322

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Aztec Data Supply Inc.

USA . 4,850 parts In-Stock

1+ parts

$1.890

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4,850

$1.890

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Ampacity Inc.

Singapore . 1,044 parts In-Stock

1+ parts

$5.050

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1,044

$5.050

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Semicontronic

India . 1,436 parts In-Stock

1+ parts

$13.050

100+ parts

$12.724

1k+ parts

$12.658

10k+ parts

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1,436

$13.050

$12.724

$12.658

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AZTECH Wire

Italy . 487 parts In-Stock

1+ parts

$18.468

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487

$18.468

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Perfect Parts

USA . 252,699 parts In-Stock

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252,699

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RC Electronics

USA . 57,389 parts In-Stock

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$0.330

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$0.300

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$0.290

57,389

-

$0.330

$0.300

$0.290

TANS Electronics

Latvia . 5,700 parts In-Stock

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5,700

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A-Z Elektronik GmbH

Germany . 5,388 parts In-Stock

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5,388

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Problanco Electronics

Mexico . 4,882 parts In-Stock

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4,882

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Kulean Microsystems

USA . 3,175 parts In-Stock

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Supply Digital

USA . 2,649 parts In-Stock

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2,649

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Corphita

USA . 2,379 parts In-Stock

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2,379

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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1,800

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SupplyDigital Components

Austria . 763 parts In-Stock

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763

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UHIMA Technologies

Türkiye . 8 parts In-Stock

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8

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Overview

Enhance your power electronics projects with the reliable MJD122TF Power BJT by Onsemi. As a leader in semiconductor manufacturing, Onsemi ensures top-notch quality and performance in every product. Ideal for applications requiring high power dissipation and efficiency, this NPN Darlington transistor with built-in diode and resistor offers exceptional value and versatility. Whether you're designing amplifiers, voltage regulators, or motor control systems, the MJD122TF provides the perfect solution for your needs. Upgrade your designs today with this advanced component from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: NPN

NPN polarity allows for easy integration into existing circuit designs and compatibility with other components.

Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR

The Darlington configuration with built-in diode and resistor simplifies circuit design and reduces the need for additional components.

Surface Mount: YES

Surface mount capability enables easy and efficient PCB assembly, saving space and reducing manufacturing costs.

Maximum Power Dissipation (Abs): 20 W

With a maximum power dissipation of 20 W, this product can handle high power loads without overheating.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy placement on PCBs and efficient use of space in the overall circuit design.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces the chances of wiring errors during installation.

Maximum Collector-Emitter Voltage: 100 V

The high maximum collector-emitter voltage of 100 V allows for use in a wide range of voltage applications.

Maximum Collector Current (IC): 8 A

The high maximum collector current of 8 A enables the product to handle high current loads efficiently.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and ensures a reliable electrical connection.

Technical Specifications

Power Bipolar Junction Transistors (BJT) MJD122TF attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Maximum Collector Current (IC):

8 A

Maximum Collector-Emitter Voltage:

100 V

Minimum DC Current Gain (hFE):

100

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

MJD122TF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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