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MC74VHCT139ADG

Onsemi

MC74VHCT139ADG by Onsemi

MC74VHCT139ADG by Onsemi is a CMOS Decoder & Drivers with 2 functions, 10.5 ns propagation delay at 5V. It has inverted output polarity and operates in -55 to 125 °C temperature range. Ideal for military applications due to its small outline package and rail packing method.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 9,120 parts In-Stock

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-

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$0.238

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$0.197

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$0.176

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DigiKey

USA . 9,120 parts In-Stock

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$0.300

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$0.300

Verical

USA . 9,120 parts In-Stock

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$0.220

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$0.220

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Digiode

USA . 1,491 parts In-Stock

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$0.283

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Nova Conductors

Japan . 100 parts In-Stock

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$14.050

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DigiKey Marketplace

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Vyrian

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Distributors (Availability)

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Corphita

USA . 1,023 parts In-Stock

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$0.268

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Corohmni

South Africa . 59 parts In-Stock

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$0.275

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AZTECH Wire

Italy . 509 parts In-Stock

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$12.850

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509

$12.850

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Continental Prestige Electronics

USA . 9,120 parts In-Stock

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$0.257

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TANS Electronics

Latvia . 6,898 parts In-Stock

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Problanco Electronics

Mexico . 3,496 parts In-Stock

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SupplyDigital Components

Austria . 1,476 parts In-Stock

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Microchip USA

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UHIMA Technologies

Türkiye . 253 parts In-Stock

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Kulean Microsystems

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Overview

Enhance your electronic projects with the MC74VHCT139ADG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This decoder & driver offers fast propagation delay, making it ideal for applications where speed is crucial. With its inverted output polarity and standard input conditioning, this versatile component provides value and efficiency to your designs. Upgrade your projects today with the MC74VHCT139ADG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the decoder & driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10.5 ns

Fast propagation delay ensures quick response times in processing input signals, making this product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation on circuit boards, saving time and labor costs.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration of this decoder & driver into existing circuitry, making it a versatile choice for various applications.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and saves space on the circuit board, making this product a cost-effective solution.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply voltage makes this decoder & driver compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The low load capacitance helps reduce signal distortion and interference, ensuring accurate data transmission and reliable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder & driver can withstand harsh environmental conditions and operate reliably in challenging thermal conditions.

Minimum Operating Temperature: -55 °C

The wide temperature range allows this product to function in both extreme hot and cold environments, increasing its versatility and usability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this decoder & driver energy-efficient and reliable in noisy electrical environments.

Technical Specifications

Decoder & Drivers MC74VHCT139ADG attributes and parameters. Explore more Decoder & Drivers devices from Onsemi

Specs

Family:

AHCT/VHCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC74VHCT139ADG Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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